Evaluation of transistor property variations within chips on 300-mm wafers using a new MOSFET array test structure

A new test structure has been designed to evaluate fluctuations of transistor properties, both within a chip and across a 300-mm wafer. The evaluation system was established with a conventional parametric tester and dc power supplies suitable for application on production lines. It was observed that threshold voltage (V/sub th/) variations increased with the reduction of the channel area. A difference was also observed in the standard deviation (/spl sigma//sub vt/) between NMOS and PMOS. From statistical evaluations, controlling CDs and improving rolloff characteristics were found to be important to reduce V/sub th/ variations.

[1]  P. Stolk,et al.  The effect of statistical dopant fluctuations on MOS device performance , 1996, International Electron Devices Meeting. Technical Digest.

[2]  Kevin K. H. Chan,et al.  80 nm poly':'silicon gated n-FETs with ultra-thin Ah03 gate dielectric for ULSI applications , 2000 .

[3]  H. Satake,et al.  Degradation of current drivability by the increase of Zr concentrations in Zr-silicate MISFET , 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).

[4]  H. Namatsu,et al.  Line-Edge Roughness: Characterization and Material Origin , 2002, 2002 International Microprocesses and Nanotechnology Conference, 2002. Digest of Papers..

[5]  A. Toriumi,et al.  Experimental study of threshold voltage fluctuation due to statistical variation of channel dopant number in MOSFET's , 1994 .

[6]  S.R. Nassif Within-chip variability analysis , 1998, International Electron Devices Meeting 1998. Technical Digest (Cat. No.98CH36217).

[7]  R. S. Johnson,et al.  Electron traps at interfaces between Si(100) and noncrystalline Al2O3, Ta2O5, and (Ta2O5)x(Al2O3)1−x alloys , 2001 .

[8]  A. Asenov,et al.  Intrinsic parameter fluctuations in decananometer MOSFETs introduced by gate line edge roughness , 2003 .

[9]  L. Ragnarsson,et al.  Ultrathin high-K gate stacks for advanced CMOS devices , 2001, International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224).

[10]  S. Samavedam,et al.  Fermi level pinning at the polySi/metal oxide interface , 2003, 2003 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.03CH37407).

[11]  A. Mocuta,et al.  80 nm polysilicon gated n-FETs with ultra-thin Al/sub 2/O/sub 3/ gate dielectric for ULSI applications , 2000, International Electron Devices Meeting 2000. Technical Digest. IEDM (Cat. No.00CH37138).

[12]  W. Sansen,et al.  Line edge roughness: characterization, modeling and impact on device behavior , 2002, Digest. International Electron Devices Meeting,.

[13]  T. Linton,et al.  Determination of the line edge roughness specification for 34 nm devices , 2002, Digest. International Electron Devices Meeting,.