hysics Simulations of Integrated

Although the electrical benefits are in miniaturized integrated circuits, their cor and reliability issues are also being raised. Thi multiphysics simulation of integrated circui designer to monitor the electrical, thermal an term behaviour of the circuit from its early multi-physics simulation tool is based on the di three networks, i.e. an electrical, a thermal network, are directly linked and simulated wi simulator. The tool was developed in a environment, i.e. Cadence®. The way the th built is described. In addition, to ach simulations, conventional CMOS models have specific multiphysics models that take addition into account, such as thermal effects, hot carri and their impact on the device performanc approaches as well as some simulation res Finally, the paper discusses the remaining pros able to perform electro-thermo-mechanica complex integrated systems. e greatly increasing rresponding design is work aims at the its that allows the nd mechanical long design stages. The irect method where and a mechanical ith a unique circuit a standard CAD hree networks are hieve multiphysics e to be replaced by nal physical effects iers induced ageing ces. The modelling ults are provided. spective work to be al simulations of