Environmental Challenges for 45-nm and 32-nm node CMOS Logic

The objective of this work is to understand the materials and energy requirements, and emissions associated with new semiconductor manufacturing technology nodes. Current and near-future CMOS technologies (for the 45-nm and 32-nm nodes) are investigated using an inventory based on bottom-up process data. The process flow of the CMOS chip is modeled by updating an existing inventory analysis (for 130 nm node devices) to include strained Si channels, metal gates, 10 layers of interconnect and high-k gate dielectrics used in 45-nm and 32-nm CMOS nodes. Conclusions are made concerning emissions of new materials and trends in life cycle energy consumption of logic devices.

[1]  Laura Peters.  Options Narrow at 45 nm , 2006 .

[2]  Laura Peters.  45 to 32 nm : Another evolutionary transition , 2007 .

[3]  F. Shadman,et al.  Comparative analysis of the manufacturing and consumer use phases of two generations of semiconductors [microprocessors] , 2004, IEEE International Symposium on Electronics and the Environment, 2004. Conference Record. 2004.

[4]  E. Williams,et al.  The 1.7 kilogram microchip: energy and material use in the production of semiconductor devices. , 2002, Environmental science & technology.

[5]  David T. Allen,et al.  Life cycle inventory development for wafer fabrication in semiconductor manufacturing , 2003, IEEE International Symposium on Electronics and the Environment, 2003..

[6]  Allan E. Smith,et al.  Breakdown of [14C]dimethylamine in soils , 1992 .

[7]  David Dornfeld,et al.  Alternatives to reduce perfluorinated compound (PFC) emissions from semiconductor dielectric etch processes: meeting environmental commitments while minimizing costs , 2003, IEEE International Symposium on Electronics and the Environment, 2003..

[8]  M. Vighi,et al.  Biodegradation and toxicity of selected amines on aquatic organisms , 1980 .

[9]  Philip H. Howard,et al.  Computer estimation of the Atmospheric gas-phase reaction rate of organic compounds with hydroxyl radicals and ozone , 1993 .

[10]  Stephen P. Boyd,et al.  Life Cycle Inventory of a CMOS Chip , 2006, Proceedings of the 2006 IEEE International Symposium on Electronics and the Environment, 2006..

[11]  F. Taiariol,et al.  Life cycle assessment of an integrated circuit product , 2001, Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190).

[12]  D. Barceloux,et al.  Ellenhorn's medical toxicology : diagnosis and treatment of human poisoning/ Matthew J. Ellenhorn ; consulting editors, Donald G. Barceloux, Seth Schonwald, Jonathan Wasserberger ; technical associate, Sylvia Syma Ellenhorn , 1996 .

[13]  Jean-Philippe Laurent,et al.  Development of parametric material, energy, and emission inventories for wafer fabrication in the semiconductor industry. , 2003, Environmental science & technology.

[14]  Cathleen Clancy,et al.  Medical toxicology: Diagnosis and treatment of human poisoning , 1995 .

[15]  K. Schischke,et al.  Life cycle inventory analysis and identification of environmentally significant aspects in semiconductor manufacturing , 2001, Proceedings of the 2001 IEEE International Symposium on Electronics and the Environment. 2001 IEEE ISEE (Cat. No.01CH37190).

[16]  Robert S. Boethling,et al.  Microbial degradation organic compounds at trace levels , 1979 .

[17]  John Doull,et al.  VIRAL DISEASES: A SYMPOSIUM , 1976, The Ulster Medical Journal.