Limits of ceramics in the 3D-MID with additively produced aluminum substrate

The range of applications for 3D-MID technology is currently limited by the use of thermoplastic basic substrates and restricted design freedom resulting from injection molding. Theserestrictions are to be overcome by replacing the thermoplastic basic substrate with aluminum oxide ceramics on the one hand and by using additive manufacturing on the other. The replacement of the thermoplastic basic substrates allows a higher thermal load on the component and paves the way for the use of highperformance electronics with corresponding development of waste heat. The use of additive manufacturing should significantly increase the freedom of design of the basic substrate. Despite all the obvious advantages of additive manufacturing using stereolithography, however, there are design limitations. Thus, the remaining adhesion of slurry to the component leads to a reduction in the possible aspect ratio of the holes, which are to be used, for example, for the electrical through-plating of the ceramic. In addition to the design aspects, another focus of this paper is the optimization of debinding times regarding the part properties especially the bending strength.