论文信息 - Measurement of Young’s modulus and residual stress of copper film electroplated on silicon wafer - 字舞流文

Measurement of Young’s modulus and residual stress of copper film electroplated on silicon wafer

Yong Zhou | W. Ding | Chunsheng Yang | G. Ding | Li Wang | Jian Chen | Ming-jun Wang | Ya-Ming Zhang | Taiyuan Zhang | J. Chen