Preparation of highly conductive polymer nanocomposites by low temperature sintering of silver nanoparticles

Highly conductive polymer nanocomposites with very low resistivity (4.8 × 10−5 Ω cm) were prepared by thermal sintering of silver nanoparticles with silver flakes dispersed in a polymer matrix at 180 °C. By comparative studies of thermal behavior of Ag nanoparticles, the critical processing temperature required to obtain very low resistivity of polymer nanocomposites has been identified for Ag nanoparticles with different surface properties. The results indicate that the decomposition temperature of surface residues on Ag nanoparticles plays a key role in the sintering of Ag nanoparticles and thus the electrical resistivity of the polymer nanocomposites. Electrical measurements of the polymer nanocomposites showed that morphological changes induced by sintering of Ag nanoparticle with Ag flakes considerably contribute to the reduction of the contact resistance between conductive fillers, increasing the nanocomposite conductivity.

[1]  U. Schubert,et al.  Inkjet Printing of Narrow Conductive Tracks on Untreated Polymeric Substrates , 2008 .

[2]  Andrew R. Siekkinen,et al.  Synthesis of silver nanoplates at high yields by slowing down the polyol reduction of silver nitrate with polyacrylamide , 2007 .

[3]  Mari Yamamoto,et al.  Novel preparation of monodispersed silver nanoparticles via amine adducts derived from insoluble silver myristate in tertiary alkylamine , 2003 .

[4]  T. Sahashi,et al.  Sintering of Ultrafine Metal Powders. I. Coalescence Growth Stage of Au and Ag , 1980 .

[5]  J. Tominaga,et al.  Thermal decomposition of a thin AgOx layer generating optical near-field , 2004 .

[6]  Wenlong Song,et al.  Preparation and characterization of Ag/AgO nanoshells on carboxylated polystyrene latex particles , 2006 .

[7]  Tao Wang,et al.  Low-Temperature Sintering with Nano-Silver Paste in Die-Attached Interconnection , 2007 .

[8]  Ching-Ping Wong,et al.  Thermal behavior of silver nanoparticles for low-temperature interconnect applications , 2005 .

[9]  Yi Li,et al.  Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications , 2006 .

[10]  W. Stark,et al.  Flame synthesis of nanocrystalline ceria-zirconia: effect of carrier liquid. , 2003, Chemical communications.

[11]  Yang Yang,et al.  Ink-Jet Printing, Self-Assembled Polyelectrolytes, and Electroless Plating: Low Cost Fabrication of Circuits on a Flexible Substrate at Room Temperature , 2005 .

[12]  Howard A. Kuhn,et al.  Inkjet printable nanosilver suspensions for enhanced sintering quality in rapid manufacturing , 2007 .

[13]  Yong Huang,et al.  Special assembly of laminated nanocomposite that mimics nacre , 2008 .

[14]  Geoffrey I N Waterhouse,et al.  The thermal decomposition of silver (I, III) oxide: A combined XRD, FT-IR and Raman spectroscopic study , 2001 .

[15]  S. Kotthaus,et al.  Study of isotropically conductive bondings filled with aggregates of nano-sited Ag-particles , 1997 .

[16]  R. Herrera-Urbina,et al.  Preparation of colloidal silver dispersions by the polyol process. Part 1—Synthesis and characterization , 1996 .

[17]  Ulrich S. Schubert,et al.  Argon plasma sintering of inkjet printed silver tracks on polymer substrates , 2009 .

[18]  Lilei Ye,et al.  Effect of Ag particle size on electrical conductivity of isotropically conductive adhesives , 1999 .

[19]  P. Calvert.  Inkjet Printing for Materials and Devices , 2001 .

[20]  Yi Li,et al.  Electronics Without Lead , 2005, Science.

[21]  G. Lu,et al.  Control of nanosilver sintering attained through organic binder burnout , 2007 .

[22]  Brian Derby,et al.  A Low Curing Temperature Silver Ink for Use in Ink‐Jet Printing and Subsequent Production of Conductive Tracks , 2005 .

[23]  B. T. Nguyen,et al.  Nitrocellulose-stabilized silver nanoparticles as low conversion temperature precursors useful for inkjet printed electronics , 2007 .

[24]  Kwan Kim,et al.  Infrared and Raman spectroscopic study of terephthalic acid adsorbed on silver surfaces , 1997 .

[25]  Wei-Ting Chen,et al.  One-step synthesis of uniform silver nanoparticles capped by saturated decanoate: direct spray printing ink to form metallic silver films. , 2009, Physical chemistry chemical physics : PCCP.

[26]  Y. Xing,et al.  Flame synthesis of nanopowders via combustion chemical vapor deposition , 2002 .

[27]  Guo-Quan Lu,et al.  Low-Temperature Sintered Nanoscale Silver as a Novel Semiconductor Device-Metallized Substrate Interconnect Material , 2006, IEEE Transactions on Components and Packaging Technologies.

[28]  Xu Chen,et al.  Tensile Behaviors and Ratcheting Effects of Partially Sintered Chip-Attachment Films of a Nanoscale Silver Paste , 2008 .

[29]  Zhi-yuan Li,et al.  Preparation and study of polyacryamide-stabilized silver nanoparticles through a one-pot process. , 2006, The journal of physical chemistry. B.

[30]  Takuto Yamaguchi,et al.  Interfacial Bonding Mechanism Using Silver Metallo-Organic Nanoparticles to Bulk Metals and Observation of Sintering Behavior , 2008 .

[31]  W. Carter,et al.  Combustion chemical vapor deposition: A novel thin‐film deposition technique , 1993 .

[32]  U. Schubert,et al.  Inkjet-printed silver tracks : low temperature curing and thermal stability investigation , 2008 .

[33]  Yi Li,et al.  Enhancement of Electrical Properties of Electrically Conductive Adhesives (ECAs) by Using Novel Aldehydes , 2006, IEEE Transactions on Components and Packaging Technologies.

[34]  Jana Soukupova,et al.  Effect of Surfactants and Polymers on Stability and Antibacterial Activity of Silver Nanoparticles (NPs) , 2008 .

[35]  Kojiro F. Kobayashi,et al.  Metal-metal bonding process using Ag metallo-organic nanoparticles , 2005 .

[36]  Ching-Ping Wong,et al.  Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization , 2005 .

[37]  K. Chou,et al.  Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives , 2005 .

[38]  Yuning Li,et al.  Printed silver ohmic contacts for high-mobility organic thin-film transistors. , 2006, Journal of the American Chemical Society.

[39]  Mari Yamamoto,et al.  Size-controlled synthesis of monodispersed silver nanoparticles capped by long-chain alkyl carboxylates from silver carboxylate and tertiary amine. , 2006, Langmuir : the ACS journal of surfaces and colloids.

[40]  Shlomo Magdassi,et al.  Ink‐Jet Printing of Metallic Nanoparticles and Microemulsions , 2005 .

[41]  Ching-Ping Wong,et al.  Surface Functionalized Silver Nanoparticles for Ultrahigh Conductive Polymer Composites , 2006 .

[42]  M. Moskovits,et al.  The geometry of several molecular ions adsorbed on the surface of colloidal silver , 1984 .

[43]  R. Street,et al.  Thermal cure effects on electrical performance of nanoparticle silver inks , 2007 .