A Method for Temperature Measurement on Reconfigurable Systems
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Thermal verification on reconfigurable systems allow several failures to be detected. Typical problems like configuration errors or bus contention are manifested producing an anomalous chip dissipation. In this work, a fully digital FPGA-oriented temperature monitoring scheme is presented. A control circuit enables a ring-oscillator during a short period and measures their output frequency, a value that is function of the die temperature. Several experiments have been performed using Xilinx 4000 series chips, obtaining sensibilities between 14 kHz per °C and 77 kHz per °C. The main advantage of the proposed method is that neither external transducers nor analog parts are necessary: all the circuits can be constructed using the standard resources of an FPGA. In addition, the complete meter can be dynamically inserted or eliminated of the system.
[1] G.M. Quenot,et al. A temperature and voltage measurement cell for VLSI circuits , 1991, Euro ASIC '91.
[2] W. Mokwa. Silicon sensors and circuits: On-chip compatibility , 1996 .
[3] Eduardo I. Boemo,et al. Thermal monitoring on FPGAs using ring-oscillators , 1997, FPL.