Back drilling in high-speed interconnect system
暂无分享,去创建一个
In recent years, power noise, switching noise (SSN), jitter and so on are gradually becoming the hot research issues in high-speed interconnect system with the signal rate rising. At the same time, the resonance distributing in the Printed Circuit Board (PCB) may also lead to the instability of the signals. Because of the high speed of the signals, the model of the PCB vias is no longer the simple channel connection with the different layers, otherwise it will destroy the continuous impedance of the signals. So Electro-Magnetic Interference (EMI) will occur as a result of discontinuous impedance in the PCB. In this paper, we propose a new way which calls back drilling to avoid the resonance and optimize the signal performance.
[1] Roger F. Harrington,et al. The excess capacitance of a microstrip via in a dielectric substrate , 1990, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[2] Xiaole Xu,et al. An approach to the analysis and detection of crosstalk faults in digital VLSI circuits , 1994, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[3] R. Harrington,et al. Quasi-static analysis of a microstrip via through a hole in a ground plane , 1988 .