Design and Integration Technology for Miniature Medical Microsystems
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C. Van Hoof | H. Neves | A.A.A. Aarts | F. Iker | P. Soussan | M. Gonzalez | E. Beyne | J. Vanfleteren | R.P. Puers | P. De Moor
[1] J. Vanfleteren,et al. Design of Metal Interconnects for Stretchable Electronic Circuits using Finite Element Analysis , 2007 .
[2] Sangwoo Lee,et al. A 32-Site 4-Channel Cochlear Electrode Array , 2006, 2006 IEEE International Solid State Circuits Conference - Digest of Technical Papers.
[3] Chris Van Hoof,et al. Wafer level temporary bonding/debonding for thin wafer handling applications , 2006 .
[4] K. Wise,et al. An implantable multielectrode array with on-chip signal processing , 1986 .
[5] K. Horch,et al. A silicon-based, three-dimensional neural interface: manufacturing processes for an intracortical electrode array , 1991, IEEE Transactions on Biomedical Engineering.
[6] K.D. Wise,et al. A 32-Site 4-Channel High-Density Electrode Array for a Cochlear Prosthesis , 2006, IEEE Journal of Solid-State Circuits.
[7] Naotaka Tanaka,et al. Silicon Through-hole Interconnection for 3D-SiP Using Room Temperature Bonding , 2006 .
[8] F A Spelman,et al. The past, present, and future of cochlear prostheses. , 1999, IEEE engineering in medicine and biology magazine : the quarterly magazine of the Engineering in Medicine & Biology Society.
[9] C. Van Hoof,et al. Influence of Extreme Thinning on 130-nm Standard CMOS Devices for 3-D Integration , 2008, IEEE Electron Device Letters.
[10] C. Van Hoof,et al. Development of vertical and tapered via etch for 3D through wafer interconnect technology , 2006, 2006 8th Electronics Packaging Technology Conference.
[11] C. Van Hoof,et al. Process technology for the fabrication of a Chip-in-Wire style packaging , 2008, 2008 58th Electronic Components and Technology Conference.
[12] E. Beyne,et al. 3D Embedding and Interconnection of Ultra Thin (≪ 20 μm) Silicon Dies , 2007, 2007 9th Electronics Packaging Technology Conference.
[13] J. Vanfleteren,et al. Design and performance of metal conductors for stretchable electronic circuits , 2008, 2008 2nd Electronics System-Integration Technology Conference.
[14] P. Renaud,et al. Partial release and detachment of microfabricated metal and polymer structures by anodic metal dissolution , 2005, Journal of Microelectromechanical Systems.