论文信息 - Fabrication and Characterization of 3-DOF Soft-Contact Tactile Sensor Utilizing 3-DOF Micro Force Moment Sensor

Fabrication and Characterization of 3-DOF Soft-Contact Tactile Sensor Utilizing 3-DOF Micro Force Moment Sensor

This paper presents the design, fabrication and characterization of a 3-DOF (3-degree of freedom) highly sensitive soft-contact tactile (SCT) sensor, which utilizes micro force moment sensing (MFMS) chip. The MFMS chip is working based on the piezoresistive effect in silicon. The MFMS chip has been packaged to produce 3-DOF SCT sensor, which has the contact part is made of silicone rubber. The sensor can independently detect three components of force (Fx', Fy', Fz') acting on the soft contact part of the sensor. The MFMS chip and the SCT sensor have been calibrated. The outputs were linear and the crosstalk was small.

[1] S. Middelhoek,et al. Silicon three-axial tactile sensor , 1996 .

[2] Wen J. Li,et al. An integrated MEMS three-dimensional tactile sensor with large force range , 2000 .

[3] Dzung Viet Dao,et al. Silicon piezoresistive six-degree of freedom force-moment micro sensor , 2003 .

[4] Toshiyuki Satoh,et al. Development of Four-Axis Contact Force Sensor with a Flexible Contact Part , 2005 .

[5] E. Hwang,et al. A Polymer-Based Flexible Tactile Sensor for Normal and Shear Load Detection , 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems.

[6] I. Shimoyama,et al. Fabrication of the Flexible Sensor Using SOI Wafer by Removing the Thick Silicon Layer , 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems.

[7] Euisik Yoon,et al. A Capacitive Proximity Sensor in Dual Implementation with Tactile Imaging Capability on a Single Flexible Platform For Robot Assistant Applications , 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems.

[8] Makoto Ishida,et al. Two-Dimensional Silicon Smart Tactile Image-Sensor with Single Sensing Diaphragm Actuated by Vibrating Pressure for Simultaneous Detection of Force and Object Hardness Distributions , 2006, 19th IEEE International Conference on Micro Electro Mechanical Systems.