论文信息 - Wafer-level Vacuum Packaging of a MEMS Resonator using the Three-layer Bonding Technique - 字舞流文

Wafer-level Vacuum Packaging of a MEMS Resonator using the Three-layer Bonding Technique

Chung-Mo Yang | H. Kim | Jong Cheol Park | Y. Na | T. Kim | Kil Son Noh | Gapseop Sim | Ki Hoon Kim