From 2-Dimensional Lithography To 3-Dimensional Structures

Lithography for IC device fabrication is a high volume high accuracy production technology. Such production characteristics are also attractive for MEMS and 3 dimensional (3D) integration processes. However, advanced lithography has a strong 2 dimensional (2D) nature and is not optimized to fabricate 3D structures. In this work, 5 exposure and etch strategies are discussed to use advanced 2D lithography to fabricate 3D structures.