Overview of Power Integrity Solutions on Package and PCB: Decoupling and EBG Isolation
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Tzong-Lin Wu | Ting-Kuang Wang | Hao-Hsiang Chuang | Hao-Hsiang Chuang | Tzong-Lin Wu | Ting-Kuang Wang
[1] Hyungsoo Kim,et al. Suppression of GHz range power/ground inductive impedance and simultaneous switching noise using embedded film capacitors in multilayer packages and PCBs , 2004 .
[2] Madhavan Swaminathan,et al. Power Integrity Modeling and Design for Semiconductors and Systems , 2007 .
[3] Tzong-Lin Wu,et al. Modeling Noise Coupling Between Package and PCB Power/Ground Planes With an Efficient 2-D FDTD/Lumped Element Method , 2007, IEEE Transactions on Advanced Packaging.
[4] Tzong-Lin Wu,et al. A novel power plane with super-wideband elimination of ground bounce noise on high speed circuits , 2005, IEEE Microwave and Wireless Components Letters.
[5] Zhenghe Feng,et al. Advanced methods to improve compactness in EBG design and utilization , 2004, IEEE Antennas and Propagation Society Symposium, 2004..
[6] Tzong-Lin Wu,et al. Design and Implementation of a Novel Hybrid Photonic Crystal Power/Ground Layer for Broadband Power Noise Suppression , 2010, IEEE Transactions on Advanced Packaging.
[7] Larry D. Smith,et al. Power distribution system design methodology and capacitor selection for modern CMOS technology , 1999 .
[8] Zhengwei Du,et al. UWB Channel Modeling and Simulation , 2007, 2007 International Conference on Microwave and Millimeter Wave Technology.
[9] I. Novak,et al. Overview of some options to create low-Q controlled-ESR bypass capacitors , 2004, Electrical Performance of Electronic Packaging - 2004.
[10] Jun Li,et al. Improvement of power integrity with novel segmented power bus structures in RF/digital SOP , 2008, 2008 International Conference on Electronic Packaging Technology & High Density Packaging.
[11] James L. Drewniak,et al. PDN Design Strategies : I . Ceramic SMT Decoupling Capacitors – What Values Should I Choose ? , 2006 .
[12] Justin Davis,et al. High-Speed Digital System Design , 2006, High-Speed Digital System Design.
[13] Kevin Slattery. Platform Interference in Wireless Systems: Models, Measurement, and Mitigation , 2008 .
[14] Jie Qin,et al. Ultra-Wideband Mitigation of Simultaneous Switching Noise Using Novel Planar Electromagnetic Bandgap Structures , 2006, IEEE Microwave and Wireless Components Letters.
[15] Nanju Na,et al. Modeling and transient simulation of planes in electronic packages , 2000 .
[16] Joungho Kim,et al. Analysis and suppression of SSN noise coupling between power/ground plane cavities through cutouts in multilayer packages and PCBs , 2005, IEEE Transactions on Advanced Packaging.
[17] Long Li,et al. Ultrawideband Suppression of Ground Bounce Noise in Multilayer PCB Using Locally Embedded Planar Electromagnetic Band-Gap Structures , 2009, IEEE Antennas and Wireless Propagation Letters.
[18] Joungho Kim,et al. Double-Stacked EBG Structure for Wideband Suppression of Simultaneous Switching Noise in LTCC-Based SiP Applications , 2006, IEEE Microwave and Wireless Components Letters.
[19] Jun Li,et al. Ground Bounce Noise Isolation with Power Plane Segmentation in System-in-Package (SiP) , 2007, 2007 International Conference on Microwave and Millimeter Wave Technology.
[20] Wiren D. Becker,et al. Mid-frequency delta-I noise analysis of complex computer system boards with multiprocessor modules and verification by measurements , 2001 .
[21] L. Smith. Simultaneous switch noise and power plane bounce for CMOS technology , 1999, IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412).
[22] K. Srinivasan,et al. Improvements in Noise Suppression for I/O Circuits Using Embedded Planar Capacitors , 2008, IEEE Transactions on Advanced Packaging.
[23] George V. Eleftheriades,et al. Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits , 2003 .
[24] Tzong-Lin Wu,et al. An Embedded Common-Mode Suppression Filter for GHz Differential Signals Using Periodic Defected Ground Plane , 2008, IEEE Microwave and Wireless Components Letters.
[25] L.D. Smith,et al. Power distribution system for JEDEC DDR2 memory DIMM , 2003, Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710).
[26] Tzong-Lin Wu,et al. Design and Modeling of a Stopband-Enhanced EBG Structure Using Ground Surface Perturbation Lattice for Power/Ground Noise Suppression , 2009, IEEE Transactions on Microwave Theory and Techniques.
[27] Juan Chen,et al. Power bus isolation using power islands in printed circuit boards , 2002 .
[28] Jiongxin Lu,et al. Recent advances in high-k nanocomposite materials for embedded capacitor applications , 2008, IEEE Transactions on Dielectrics and Electrical Insulation.
[29] Tzong-Lin Wu,et al. Electromagnetic bandgap power/ground planes for wideband suppression of ground bounce noise and radiated emission in high-speed circuits , 2005 .
[30] Herbert Reichl,et al. A novel Interconnected Patch-Ring (IPR) structure for noise isolation , 2009, 2009 IEEE International Symposium on Electromagnetic Compatibility.
[31] Junho Lee,et al. 3 GHz wide frequency model of ferrite bead for power/ground noise simulation of high-speed PCB , 2002, Electrical Performance of Electronic Packaging,.
[32] Tzong-Lin Wu,et al. A Novel Power/Ground Layer Using Artificial Substrate EBG for Simultaneously Switching Noise Suppression , 2008, IEEE Transactions on Microwave Theory and Techniques.
[33] R.R. Tummala,et al. SOP: what is it and why? A new microsystem-integration technology paradigm-Moore's law for system integration of miniaturized convergent systems of the next decade , 2004, IEEE Transactions on Advanced Packaging.
[34] James L. Drewniak,et al. Power bus decoupling on multilayer printed circuit boards , 1995 .
[35] W.E. McKinzie. A Hybrid Electromagnetic Bandgap (EBG) Power Plane with Discrete Inductors for Broadband Noise Suppression , 2007, 2007 IEEE Electrical Performance of Electronic Packaging.
[36] F. Olyslager,et al. Study of the ground bounce caused by power plane resonances , 1998 .
[37] I. Novak. Lossy power distribution networks with thin dielectric layers and/or thin conductive layers , 2000 .
[38] Ki Hyuk Kim,et al. Design of EBG Power Distribution Networks With VHF-Band Cutoff Frequency and Small Unit Cell Size for Mixed-Signal Systems , 2007, IEEE Microwave and Wireless Components Letters.
[39] Ding-Bing Lin,et al. Mitigation of simultaneous switching noise in high speed circuit using electromagnetic bandgap structures with interdigial meander bridge , 2007, 2007 6th International Conference on Information, Communications & Signal Processing.
[40] Ruey-Beei Wu,et al. Optimization for the Locations of Decoupling Capacitors in Suppressing the Ground Bounce by Genetic Algorithm , 2005 .
[41] Joungho Kim,et al. High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions , 2005 .
[42] Tzong-Lin Wu,et al. A photonic crystal power/ground layer for eliminating simultaneously switching noise in high-speed circuit , 2006, IEEE Transactions on Microwave Theory and Techniques.
[43] Hai-Young Lee,et al. A $S$-Bridged Inductive Electromagnetic Bandgap Power Plane for Suppression of Ground Bounce Noise , 2007, IEEE Microwave and Wireless Components Letters.
[44] E. Rajo-Iglesias,et al. Size Reduction of Mushroom-Type EBG Surfaces by Using Edge-Located Vias , 2007, IEEE Microwave and Wireless Components Letters.
[45] Jinwoo Choi,et al. A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications , 2004, Proceedings. 2004 IEEE Radio and Wireless Conference (IEEE Cat. No.04TH8746).
[46] Lin-Kun Wu,et al. A theoretical investigation of the resonance damping performance of magnetic material coating in power/ground plane structures , 2005 .
[47] Tzong-Lin Wu,et al. Coupling of the ground bounce noise to the signal trace with via transition in partitioned power bus of PCB , 2002, 2002 IEEE International Symposium on Electromagnetic Compatibility.
[48] Joungho Kim,et al. Power distribution networks for system-on-package: status and challenges , 2004, IEEE Transactions on Advanced Packaging.
[49] V. Sundaram,et al. Design, Modeling, and Characterization of Embedded Capacitor Networks for Core Decoupling in the Package , 2007, IEEE Transactions on Advanced Packaging.
[50] Christian Romero,et al. Design and characterization of fully Embedded Passive components on multilayer organic-based substrate for highly compact SOP applications , 2009, 2009 59th Electronic Components and Technology Conference.
[51] B. Archambeault,et al. The effect of decoupling capacitor distance on printed circuit boards using both frequency and time domain analysis , 2005, 2005 International Symposium on Electromagnetic Compatibility, 2005. EMC 2005..
[52] Wansoo Nah,et al. Low Power Noise Multilayer PCB with Discrete Decoupling Capacitors Inside , 2008, 2008 10th Electronics Packaging Technology Conference.
[53] Andreas C. Cangellaris,et al. Reference plane parasitics modeling and their contribution to the power and ground path , 1994 .
[54] James L. Drewniak,et al. The first is entitled “ PDN Design Strategies : II . Ceramic SMT Decoupling Capacitors – Does Location Matter ? ” , 2006 .
[55] Jingook Kim,et al. Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards , 2006, IEEE Transactions on Electromagnetic Compatibility.
[56] Chen Jia,et al. A Power Plane With Wideband SSN Suppression Using a Multi-Via Electromagnetic Bandgap Structure , 2007, IEEE Microwave and Wireless Components Letters.
[57] I. Novak. Reducing simultaneous switching noise and EMI on ground/power planes by dissipative edge termination , 1999 .
[58] H. Kroger,et al. Improving signal integrity in circuit boards by incorporating embedded edge terminations , 2002 .
[59] Tzong-Lin Wu,et al. Numerical and experimental investigation of radiation caused by the switching noise on the partitioned DC reference planes of high speed digital PCB , 2004 .
[60] Toshio Sudo,et al. EMC ’ 09 / Kyoto Broadband Reduction of Swiching Noise By Embedding High-Density Thin-Film Capacitor In a Laminated Package , 2009 .
[61] Tzong-Lin Wu,et al. A novel power planes with low radiation and broadband suppression of ground bounce noise using photonic bandgap structures , 2004, IEEE Microwave and Wireless Components Letters.
[62] S. Kahng. GA-optimized decoupling capacitors damping the rectangular power-bus' cavity-mode resonances , 2006, IEEE Microwave and Wireless Components Letters.
[63] Istvan Novak,et al. Distributed matched bypassing for board-level power distribution networks , 2002 .
[64] Minjia Xu,et al. Power-bus decoupling with embedded capacitance in printed circuit board design , 2003 .
[65] Madhavan Swaminathan,et al. Automatic package and board decoupling capacitor placement using genetic algorithms and M-FDM , 2008, 2008 45th ACM/IEEE Design Automation Conference.
[66] Omar M. Ramahi,et al. Simultaneous switching noise mitigation in PCB using cascaded high-impedance surfaces , 2004 .
[67] Tatsuo Itoh,et al. Rejection of SSN coupling in multilayer PCB using a conductive layer , 1998, IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370).
[68] Tsun-Hsu Chang. Minimizing switching noise in a power distribution network using external coupled resistive termination , 2005, IEEE Transactions on Advanced Packaging.
[69] T. Itoh,et al. A Novel Wideband Common-Mode Suppression Filter for Gigahertz Differential Signals Using Coupled Patterned Ground Structure , 2009, IEEE Transactions on Microwave Theory and Techniques.
[70] T.M. Zeeff,et al. Reducing power bus impedance at resonance with lossy components , 2001, IEEE 10th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No. 01TH8565).
[71] O.M. Ramahi,et al. A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface , 2003, IEEE Microwave and Wireless Components Letters.
[72] Jun Fan,et al. Quantifying SMT decoupling capacitor placement in dc power-bus design for multilayer PCBs , 2001 .