Analysis of Ni silicide abnormal growth mechanism using advanced TEM techniques
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K. Asai | K. Maekawa | K. Kashihara | T. Yamaguchi | Y. Hirose | S. Kudo | N. Murata | K. Asayama | E. Murakami | N. Hashikawa
[1] K. Asai,et al. A Novel Low Leakage-Current Ni SALICIDE Process in nMOSFETs on Si(110) Substrate , 2007, 2007 IEEE International Electron Devices Meeting.
[2] H. Mori,et al. Polymorphs Discrimination of Nickel Silicides in Device Structure by Improved Analyses of Low Loss Electron Energy Loss Spectrum , 2007 .
[3] K. Asai,et al. Suppression of Anomalous Gate Edge Leakage Current by Control of Ni Silicidation Region using Si Ion Implantation Technique , 2006, 2006 International Electron Devices Meeting.
[4] K. Maekawa,et al. Improvement of thermal stability of nickel silicide using N2ion implantation prior to nickel film deposition , 2006, 2006 International Workshop on Junction Technology.
[5] M. Sherony,et al. 65nm cmos technology for low power applications , 2005, IEEE InternationalElectron Devices Meeting, 2005. IEDM Technical Digest..
[6] Kazuya Ohuchi,et al. Junction Leakage Generation by NiSi Thermal Instability Characterized Using Damage-Free n+/p Silicon Diodes , 2004 .
[7] P. Midgley,et al. 3D electron microscopy in the physical sciences: the development of Z-contrast and EFTEM tomography. , 2003, Ultramicroscopy.
[8] T. Aoyama,et al. Time-resolved acquisition technique for spatially-resolved electron energy-loss spectroscopy by energy-filtering TEM. , 2002, Journal of electron microscopy.
[9] Karen Maex,et al. In situ transmission electron microscopy study of Ni silicide phases formed on (001) Si active lines , 2001 .
[10] M. Kase,et al. Dependence of thermal stability of NiSi and Ni(Pt)Si /Si on crystal orientation , 2008 .