A Novel High-Temperature Planar Package for SiC Multichip Phase-Leg Power Module
暂无分享,去创建一个
Puqi Ning | Fei Wang | Guo-Quan Lu | F. Wang | K. Ngo | P. Ning | G. Lu | T. Lei | K. Rajashekara | Kaushik Rajashekara | Khai D T Ngo | Thomas Guangyin Lei
[1] H. Schwarzbauer,et al. Novel large area joining technique for improved power device performance , 1989, Conference Record of the IEEE Industry Applications Society Annual Meeting,.
[2] Tim Sammon,et al. DirectFETTM-A Proprietary New Source Mounted Power Package for Board Mounted Power , 2002 .
[3] J. D. van Wyk,et al. High-Temperature Operation of SiC Power Devices by Low-Temperature Sintered Silver Die-Attachment , 2007, IEEE Transactions on Advanced Packaging.
[4] G. Lu,et al. Sintered nanosilver paste for high-temperature power semiconductor device attachment , 2009 .
[5] K.D.T. Ngo,et al. Effects of Large-Temperature Cycling Range on Direct Bond Aluminum Substrate , 2009, IEEE Transactions on Device and Materials Reliability.
[6] U. Schlapbach,et al. 4.5kV press pack IGBT designed for ruggedness and reliability , 2004, Conference Record of the 2004 IEEE Industry Applications Conference, 2004. 39th IAS Annual Meeting..
[7] R. Fillion,et al. High frequency, low cost, power packaging using thin film power overlay technology , 1995, Proceedings of 1995 IEEE Applied Power Electronics Conference and Exposition - APEC'95.
[8] G. Lu,et al. Low-Temperature Sintering of Nanoscale Silver Paste for Power Chip Attachment , 2008 .
[9] R. Lai,et al. SiC Wirebond Multi-Chip Phase-Leg Module Packaging Design and Testing for Harsh Environment , 2009, 2009 Twenty-Fourth Annual IEEE Applied Power Electronics Conference and Exposition.
[10] Edward Hanna,et al. Demonstration of silicon carbide (SiC) -based motor drive , 2003, IECON'03. 29th Annual Conference of the IEEE Industrial Electronics Society (IEEE Cat. No.03CH37468).
[11] H. Kawafuji,et al. Ultra-small compact transfer molded package for power modules , 2008, 2008 58th Electronic Components and Technology Conference.
[12] R. Burgos,et al. Three-Phase Ac Buck Rectifier using Normally-On SiC JFETs at 150 kHz Switching Frequency , 2007, 2007 IEEE Power Electronics Specialists Conference.
[13] D.C. Katsis,et al. Development of an extreme temperature range silicon carbide power module for aerospace applications , 2008, 2008 IEEE Power Electronics Specialists Conference.
[14] Philippe Lasserre,et al. 3D Integration of Power Semiconductor Devices based on Surface Bump Technology , 2008 .
[15] H. Mantooth,et al. Power Conversion With SiC Devices at Extremely High Ambient Temperatures , 2007, IEEE Transactions on Power Electronics.
[16] F. Udrea,et al. High performance cooling system for automotive inverters , 2007, 2007 European Conference on Power Electronics and Applications.
[17] F. Wang,et al. Survey on High-Temperature Packaging Materials for SiC-Based Power Electronics Modules , 2007, 2007 IEEE Power Electronics Specialists Conference.
[18] Mark Johnson,et al. New technology and tool for enhanced packaging of semiconductor power devices , 2009, 2009 IEEE International Symposium on Industrial Electronics.