Investigation of novel leveler Rhodamine B on copper superconformal electrodeposition of microvias by theoretical and experimental studies

[1]  Jin-qiu Zhang,et al.  A novel bright additive for copper electroplating: electrochemical and theoretical study , 2022, Ionics.

[2]  Anmin Liu,et al.  The Influence of Leveler Brilliant Green on Copper Superconformal Electroplating Based on Electrochemical and Theoretical study , 2022, Journal of Industrial and Engineering Chemistry.

[3]  Q. Lv,et al.  Molecular‐Crowding Effect Mimicking Cold‐Resistant Plants to Stabilize the Zinc Anode with Wider Service Temperature Range , 2022, Advanced materials.

[4]  Jin-qiu Zhang,et al.  Influence of Suppressing Additive Malachite Green on Superconformal Cobalt electrodeposition , 2022, Journal of Electroanalytical Chemistry.

[5]  Peixia Yang,et al.  Zinc-assisted MgO Template Synthesis of Porous Carbon-Supported Fe-Nx Sites for Efficient Oxygen Reduction Reaction Catalysis in Zn-air Batteries , 2022, Applied Catalysis B: Environmental.

[6]  G. Avitabile,et al.  An Optimization Framework for the Design of High-Speed PCB VIAs , 2022, Electronics.

[7]  Shigang Sun,et al.  Electrochemical and in-situ FTIR spectroscopic studies of gentian violet as a novel leveler in through-holes metallization for printed circuit board applications , 2022, Electrochimica Acta.

[8]  Chuanjing Xu,et al.  Optimization of electrodeposition nanocrytalline Ni-Fe alloy coatings for the replacement of Ni coatings , 2022, Journal of Alloys and Compounds.

[9]  Joelle L. Bennett,et al.  Advanced PCB technologies for space and their assessment using up-to-date standards , 2021, CEAS Space Journal.

[10]  R. Tummala,et al.  High-density low-loss millimeter-wave package interconnects with the impact of dielectric-material surface roughness , 2021, Applied Physics Letters.

[11]  Peixia Yang,et al.  Recent Advances in Electroplating of Through-Hole Copper Interconnection , 2021, Electrocatalysis.

[12]  Xuehua Zhao,et al.  Interface adhesion enhancement by condensed aromatic ring expansion of naphthalene imide derivatives for microvia metallization by copper electroplating , 2021, Thin Solid Films.

[13]  C. Su,et al.  Modulating electronic structure of metal-organic frameworks by introducing atomically dispersed Ru for efficient hydrogen evolution , 2020, Nature Communications.

[14]  M. Hayase,et al.  Microfluidic Device for In Situ Observation of Bottom-Up Copper Electrodeposition in a TSV-Like Structure , 2020 .

[15]  N. Xiao,et al.  Function of Sulfhydryl (–HS) Group During Microvia Filling by Copper Plating , 2020 .

[16]  Guannan Yang,et al.  Bis-(sodium sulfoethyl)-disulfide: A Promising Accelerator for Super-conformal Copper Electrodeposition with Wide Operating Concentration Ranges , 2020 .

[17]  N. Xiao,et al.  Special electrochemical behaviour of sodium thiazolinyl-dithiopropane sulphonate during microvia filling , 2019, Transactions of the IMF.

[18]  Zhongliang Xiao.  Electrochemical Studies and Molecular Dynamics Simulation of the Interaction between Accelerators and Cu Surface During the Electroplating Process , 2019, International Journal of Electrochemical Science.

[19]  K. Kondo,et al.  Communication—Bottom-Up TSV Filling Using Sulfonated Diallyl Dimethyl Ammonium Bromide Copolymer as a Leveler , 2019, Journal of The Electrochemical Society.

[20]  Y. Qiang,et al.  The effect of tricyclazole as a novel leveler for filling electroplated copper microvias , 2018, Journal of Electroanalytical Chemistry.

[21]  Wei‐dong He,et al.  Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole , 2018, Electrochimica Acta.

[22]  T. Moffat,et al.  SEIRAS Study of Chloride-Mediated Polyether Adsorption on Cu. , 2018, The journal of physical chemistry. C, Nanomaterials and interfaces.

[23]  Jiaxin Li,et al.  (Invited) Reduction Behavior of NTBC and MTT: Relevance to Cu Deposition via Superconformal Filling of Through Glass Vias , 2018, ECS Transactions.

[24]  N. Xiao.  Structural Effect of Polymers on Their Microvia Filling Performance as Suppressors During the Copper Electroplating , 2017 .

[25]  Hong Zhu,et al.  Microvia Filling by Copper Electroplating Using a Modified Safranine T as a Leveler , 2017 .

[26]  Zengling Wang,et al.  2-Mercaptopyridine as a new leveler for bottom-up filling of micro-vias in copper electroplating , 2016 .

[27]  John U. Knickerbocker,et al.  An overview of through-silicon-via technology and manufacturing challenges , 2015 .

[28]  Zengling Wang,et al.  A study of bottom-up electroplated copper filling by the potential difference between two rotating speeds of a working electrode , 2014 .

[29]  Peixia Yang,et al.  Prediction of a new leveler (N-butyl-methyl piperidinium bromide) for through-hole electroplating using molecular dynamics simulations , 2012 .

[30]  Nguyen Cao Truong Hai,et al.  Adsorption behavior of redox-active suppressor additives: Combined electrochemical and STM studies , 2011 .

[31]  Marco Arnold,et al.  Classification of suppressor additives based on synergistic and antagonistic ensemble effects , 2011 .

[32]  T. Moffat,et al.  Superconformal Electrodeposition for 3-Dimensional Interconnects , 2010 .

[33]  Wei-Ping Dow,et al.  Microvia filling by copper electroplating using diazine black as a leveler , 2009 .

[34]  Wei-Ping Dow,et al.  Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers , 2009 .

[35]  Wei Wang,et al.  Adsorption Behavior and Related Mechanism of Janus Green B during Copper Via-Filling Process , 2009 .

[36]  Wei-Ping Dow,et al.  Through-Hole Filling by Copper Electroplating , 2008 .

[37]  A. Etcheberry,et al.  Investigation of organics adsorption and inclusion at the growing interfaces during the Damascene process , 2008 .

[38]  Richard D. Braatz,et al.  Erratum: Effect of Additives on Shape Evolution during Electrodeposition: I. Multiscale Simulation with Dynamically Coupled Kinetic Monte Carlo and Moving-Boundary Finite-Volume Codes [ J. Electrochem. Soc. , 154 , D230 (2007) ] , 2007 .

[39]  Thomas P. Moffat,et al.  Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling , 2006 .

[40]  C. Mele,et al.  Study on levellers for Cu electrodeposition from acidic sulphate solution: an in situ spectroelectrochemical approach , 2006 .

[41]  Claude Gabrielli,et al.  A model for copper deposition in the damascene process , 2006 .

[42]  Wei-Ping Dow,et al.  Influence of Molecular Weight of Polyethylene Glycol on Microvia Filling by Copper Electroplating , 2005 .

[43]  Yadong Li,et al.  Surface enhanced Raman scattering effects of silver colloids with different shapes. , 2005, The journal of physical chemistry. B.

[44]  Wei-Ping Dow,et al.  Influence of convection-dependent adsorption of additives on microvia filling by copper electroplating , 2005 .

[45]  Wei-Ping Dow,et al.  Roles of chloride ion in microvia filling by copper electrodeposition -II. Studies using EPR and galvanostatic measurements , 2005 .

[46]  T. Moffat,et al.  Electrodeposition of Copper in the SPS-PEG-Cl Additive System I. Kinetic Measurements: Influence of SPS , 2004 .

[47]  Wei-Ping Dow,et al.  Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling , 2003 .

[48]  Andrew A. Gewirth,et al.  Inhibition due to the interaction of polyethylene glycol, chloride, and copper in plating baths: A surface-enhanced Raman study , 2003 .

[49]  J. Harb,et al.  Additive Behavior during Copper Electrodeposition in Solutions Containing Cl − , PEG, and SPS , 2003 .

[50]  David J. Duquette,et al.  Mass Transfer Models for the Electrodeposition of Copper with a Buffering Agent , 2001 .

[51]  J. Bonevich,et al.  Superconformal Electrodeposition of Copper in 500–90 nm Features , 2000 .

[52]  Panayotis C. Andricacos,et al.  Damascene copper electroplating for chip interconnections , 1998, IBM J. Res. Dev..

[53]  Kresse,et al.  Efficient iterative schemes for ab initio total-energy calculations using a plane-wave basis set. , 1996, Physical review. B, Condensed matter.

[54]  G. Kresse,et al.  Efficiency of ab-initio total energy calculations for metals and semiconductors using a plane-wave basis set , 1996 .

[55]  B. Scharifker,et al.  Theoretical and experimental studies of multiple nucleation , 1983 .

[56]  B. Scharifker,et al.  Electrochemical nucleation: Part I. General considerations , 1982 .