Effects of packaging process steps on the functionality of MEMS devices : Investigation of electrical interconnection on lubricated MEMS

Two challenges for interconnecting/interfacing MEMS devices to the real world are reliable signal transfer and media compatible material interfaces. For example, in electrical signal interconnection, poly-Si MEMS surfaces have a lubrication layer to reduce stiction and friction at physically static and dynamic interfaces, respectively. In this paper, we present the results of a study of wirebond and flip-chip interconnections on self-assembled monolayer (SAM) lubricated MEMS.