Stackable system-on-packages with integrated components

In recent years, an increasing number of mobile electronic products such as mobile communicators, combining the functions of a mobile phone and a PDA are beginning to emerge. These devices are highly miniaturized and yet provide a variety of functions at ever higher speeds. Additionally, the product cycle time is getting faster, requiring short design and production cycles at ever lower cost. These trends are posing great set of challenges for the microelectronics and packaging and assembly industry. There seem to be two approaches to solve these challenges-system-in-package (SIP) by stacking of packaged integrated circuits (ICs) or system-on-package (SOP) by stacking of packages with embedded active and passive components. The buried components in SOP require significantly less space in the Z direction, thereby allowing the formation of three-dimensional (3-D) stackable packages. In this paper, two approaches for stacking SOPs were presented, the so-called chip-in-polymer (CIP) technology and duromer molded interconnect device (MID)/WLP technology.

[1]  Andrew Kusiak,et al.  Development of modular products , 1996 .

[2]  Henning Braunisch,et al.  Electrical performance of bumpless build-up layer packaging , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[3]  Joy Laskar,et al.  Digital and RF integration in system-on-a-package (SOP) , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).

[4]  Robert J. Wojnarowski,et al.  Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronics , 1994 .

[5]  J.K. Kivilahti,et al.  Panel-sized integrated module board manufacturing , 2001, First International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics. Incorporating POLY, PEP & Adhesives in Electronics. Proceedings (Cat. No.01TH8592).

[6]  Andreas Ostmann,et al.  A New Wafer Level Packaging Approach: Encapsulation, Metallization and Laser Structuring for Advanced System in Package Manufacturing , 2005 .

[7]  H. Schroder,et al.  Planar glass waveguides for ffigh performance electrical-optical-circuit-boards (EOCB) - the glass-layer-concept , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[8]  Herbert Reichl,et al.  Modular systems for sensor integration , 2002 .

[9]  Ravi Mahajan.  Emerging Directions For Packaging Technologies 62 Emerging Directions For Packaging Technologies , 2002 .

[10]  Jorma Kivilahti,et al.  Solderless interconnection and packaging technique for embedded active components , 1999, 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299).

[11]  Werner Karl Schomburg,et al.  Assembly for micromechanics and LIGA , 1995 .

[12]  H. Reichl,et al.  MEMS modular packaging and interfaces , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[13]  Andreas Ostmann,et al.  Integration of passive and active components into build-up layers , 2002, 4th Electronics Packaging Technology Conference, 2002..

[14]  Robert J. Wojnarowski,et al.  Development of a plastic encapsulated multichip technology for high volume, low cost commercial electronics , 1994, 1994 Proceedings. 44th Electronic Components and Technology Conference.

[15]  Andreas Ostmann,et al.  Flip chip soldering and adhesive bonding on organic substrates , 1995, Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium.