Microstrip Dielectric Substrate Material Characterization with Temperature Effect

─ This paper describes a dielectric substrate materials electromagnetic (EM) characterization method in the ultra-wideband (UWB) frequencies from DC to 5 GHz by taking into account the temperature influence. The proposed method theoretical principle is described and fundamentally built with the analytical formulation from the microstrip transmission line (TL) theory. From this basic concept, the analytical equations enabling to determine the dielectric material relative permittivity and loss tangent from the given S-parameters are established. The characterization method is validated with numerical and experimental tests. As proof of concept, a prototype of microstrip TL printed on FR4 epoxy substrate was designed, fabricated and experimented. The relative permittivity and loss tangent were extracted in the UWB frequency from DC to 5 GHz in the range of temperature varied from 40°C to 140°C. This innovative characterization method is useful for the investigation on the frequency dependent and especially by taking into account the temperature influence on the substrate materials; for example, during the microstrip circuits design phase. Index Terms ─ Measurement method, microstrip line, relative permittivity, substrate material, temperature effect.

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