Transistor-level characterization of static random access memory bit failures induced by random telegraph noise

Bit failure events induced by random telegraph noise (RTN) for silicon-on-thin-buried-oxide (SOTB) static random access memory (SRAM) cells were characterized by directly monitoring the storage node voltage of individual cells, using a device-matrix-array (DMA) test element group (TEG). Correlating the cell-level RTN and failure waveforms with the RTN waveforms of individual transistors that constitute the same cell, RTN of a specific transistor that causes the cell failure was identified.

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