论文信息 - A 3 V MMIC chip set for 1.9 GHz mobile communication systems

A 3 V MMIC chip set for 1.9 GHz mobile communication systems

A MMIC chip-set for 1.9 GHz mobile communication systems consists of a single-pole double-throw (SPDT) switch, a fully-integrated power amplifier, a low-noise amplifier integrated with an auto-gain-control (AGC) amplifier and an up-converter that is integrated on the same chip with a down-converter. All four chips operate at a 3/spl plusmn/0.2 V power supply and are fabricated using an ion-implanted GaAs MESFET process. This paper describes characteristics of the chip set and discusses the switch that employs a design technique for improved power performance.

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