Charge Transport and Degradation in HfO2 and HfOx Dielectrics

We combine experiments and simulations to investigate leakage current and breakdown (BD) in stoichiometric and sub-stoichiometric hafnium oxides. Using charge-transport simulations based on phonon-assisted carrier tunneling between trap sites, we demonstrate that higher currents generally observed in HfOx are due to a higher density of the as-grown oxygen vacancy defects assisting the charge transport. Reduction of the dielectric BD field (EBD) in HfOx is explained by the lower zero-field activation energy (EA,G) of the defect generation process, as extracted from time-dependent dielectric BD experiments.

[1]  O. Pirrotta,et al.  Microscopic understanding and modeling of HfO2 RRAM device physics , 2012, 2012 International Electron Devices Meeting.

[2]  T. Schroeder,et al.  Hard x-ray photoelectron spectroscopy study of the electroforming in Ti/HfO2-based resistive switching structures , 2012 .

[3]  C. Cagli,et al.  Understanding the Role of the Ti Metal Electrode on the Forming of HfO2-Based RRAMs , 2012, 2012 4th IEEE International Memory Workshop.

[4]  S. Koveshnikov,et al.  Asymmetry, Vacancy Engineering and Mechanism for Bipolar RRAM , 2012, 2012 4th IEEE International Memory Workshop.

[5]  Shimeng Yu,et al.  Metal–Oxide RRAM , 2012, Proceedings of the IEEE.

[6]  D. Gilmer,et al.  Metal oxide resistive memory switching mechanism based on conductive filament properties , 2011 .

[7]  M. Porti,et al.  Grain boundary-driven leakage path formation in HfO2 dielectrics , 2011, 2010 Proceedings of the European Solid State Device Research Conference.

[8]  W. B. Knowlton,et al.  A Physical Model of the Temperature Dependence of the Current Through $\hbox{SiO}_{2}\hbox{/}\hbox{HfO}_{2}$ Stacks , 2011, IEEE Transactions on Electron Devices.

[9]  L. Larcher,et al.  A physics-based model of the dielectric breakdown in HfO2 for statistical reliability prediction , 2011, 2011 International Reliability Physics Symposium.

[10]  D. Wolansky,et al.  On the role of Ti adlayers for resistive switching in HfO2-based metal-insulator-metal structures: Top versus bottom electrode integration , 2011 .

[11]  L. Goux,et al.  Evidences of oxygen-mediated resistive-switching mechanism in TiN\HfO2\Pt cells , 2010 .

[12]  Frederick T. Chen,et al.  Low power and high speed bipolar switching with a thin reactive Ti buffer layer in robust HfO2 based RRAM , 2008, 2008 IEEE International Electron Devices Meeting.

[13]  K. Mistry,et al.  The High-k Solution , 2007, IEEE Spectrum.

[14]  J. McPherson,et al.  Thermochemical description of dielectric breakdown in high dielectric constant materials , 2003 .

[15]  M. Kimura Field and temperature acceleration model for time-dependent dielectric breakdown , 1999 .