Novel wire bond material for advanced power module packages

Abstract Novel heavy wire bonds made of an Al and Cu composite material are introduced. Besides the excellent mechanical and electrical properties an Al-clad Cu wire bond (Al/Cu) provides outstanding stability under cyclic load. To evaluate the potential of the novel material two different types of Al/Cu wires were investigated with respect to processability, ampacity and power cycling capability. In contrast to other advanced wire bond materials no change in the metallization of the chip surface is necessary to establish a stable bonding process.