Finishing characteristics of brittle materials by ELID-lap grinding using metal-resin bonded wheels

Abstract ELID-lap grinding is a method of constant pressure grinding which utilizes an electrically conductive wheel and the electrolytic in-process dressing (ELID) method. This method has the advantage of using micro grain-wheels above #10 000 and also, through simple modification, can be used on existing lap machines. To find the characteristics of metal-resin bonded wheels developed for ELID-lap grinding, experiments on the grinding of brittle materials were performed using wheels with a variety of grain diameters. The wheels used in the experiments were #8000, #120 000 and #3 000 000 metal-resin bonded diamond wheels (#8000 MRB-D, #120 000 MRB-D and #3 000 000 MRB-D wheels). The workpieces were silicon and glass. The results of the experiments showed that stable grinding can be achieved with the #8000 to #3 000 000 MRB-D wheels. With the #3 000 000 MRB-D wheel, very smooth surface finishes were obtained for both silicon (PV 2.8 nm) and glass (PV 2.5 nm). Atomic Force Microscope (AFM) and Scanning Electron Microscope (SEM) observations indicated these surfaces to be very smooth in the order of several nanometers, obtained by mechanical removal using an ultrafine wheel.