Reliability, Test, and IDDe Measurements

IDDe measurements are strongly identified with CMOS IC testmg, however IDDQ also has long term links to IC reliability. This paper overviews the association of reliability and IDDQ testing. Three reliability topics are discussed: fundamental failure mechanisms, the relation of ID:Q. to burn-in, and the use of test data to predict reliability performance. divisions neglecting others such as, corrosion, soft errors, or ESD types of failures. Electromigration (EM)

[1]  Kenneth M. Wallquist.  On the effect of I/sub SSQ/ testing in reducing early failure rate , 1995, Proceedings of 1995 IEEE International Test Conference (ITC).

[2]  Jon Klema,et al.  Reliability Implications of Nitrogen Contamination During Deposition of Sputtered Aluminum/Silicon Metal Films , 1984, 22nd International Reliability Physics Symposium.

[3]  I. Blech.  Electromigration in thin aluminum films on titanium nitride , 1976 .

[4]  Edward I. Cole,et al.  Case history: Failure analysis of a CMOS SRAM with an intermittent open contact , 1991 .

[5]  Timothy R. Henry,et al.  Burn-in elimination of a high volume microprocessor using I/sub DDQ/ , 1996, Proceedings International Test Conference 1996. Test and Design Validity.

[6]  Charvaka Duvvury,et al.  Trends for deep submicron VLSI and their implications for reliability , 1995, Proceedings of 1995 IEEE International Reliability Physics Symposium.

[7]  Ping-Chung Li,et al.  Electromigration: the time bomb in deep-submicron ICs , 1996 .

[8]  Kaushik De,et al.  Evaluation of Early Failure Screening Methods , 1996 .

[9]  B. Doyle,et al.  AC versus DC hot-carrier degradation in n-channel MOSFETs , 1993 .

[10]  Charles F. Hawkins,et al.  Reliability and Electrical Properties of Gate Oxide Shorts in CMOS ICs , 1986, ITC.

[11]  F. Kuper,et al.  Relation between yield and reliability of integrated circuits: experimental results and application to continuous early failure rate reduction programs , 1996, Proceedings of International Reliability Physics Symposium.

[12]  J. G. Prendergast.  Reliability, yield and quality correlation for a particular failure mechanism , 1993, 31st Annual Proceedings Reliability Physics 1993.