Bipolar SCR ESD protection in a 0.25 /spl mu/m Si-Ge process using subcollector region modification

ESD operation of new Bipolar SCR (BSCR) devices for 0.25 /spl mu/m Si-Ge process with shallow epi-layer was studied. Two new BSCR device variants are proposed and validated using 2-D physical process and device simulation followed by the test chip based ESD measurements. Both variants rely on modifications to the subcollector to reduce P-SCR-emitter region isolation.

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