论文信息 - Effect of Compaction Pressure on Microstructure and Properties of Copper-Based Composite Prepared by Mechanical Alloying and Powder Metallurgy

Effect of Compaction Pressure on Microstructure and Properties of Copper-Based Composite Prepared by Mechanical Alloying and Powder Metallurgy

In this study, copper-tungsten carbide composite was produced by mechanical alloying and powder metallurgy. The compaction pressures were varied from 100 to 600 MPa for observation on microstructure and properties of the composite. The result showed the microstructure was densified with the increased of compaction pressure. Within compaction pressure no fracturing was occurred. Increasing compaction pressure increased the density, hardness and electrical conductivity of the composite which related to the reduced of porosity area.

Z. Hussain | Y. Mahani

[1] A. Simchi,et al. Effect of nanoscaled reinforcement particles on the structural evolution of aluminium powder during mechanical milling , 2009 .

[2] M. Gu,et al. The compressibility of Cu/SiCp powder prepared by high-energy ball milling , 2008 .

[3] P. Deshpande. Wear Resistance and Electrical Property of Infrared Processed Copper/Tungsten Carbide Composites , 2006 .

[4] Fehim Findik,et al. Microstructure, hardness and electrical properties of silver-based refractory contact materials , 2003 .

[5] Y. Wong,et al. Effect of TiC in copper–tungsten electrodes on EDM performance , 2001 .