INVESTIGATION OF HEAT TRANSFER IN INTEGRATED CIRCUITS

[1]  Piotr Dziurdzia,et al.  From constant to temperature dependent parameters based electrothermal models of TEG , 2009, 2009 MIXDES-16th International Conference Mixed Design of Integrated Circuits & Systems.

[2]  Diana Marculescu,et al.  Analysis of dynamic voltage/frequency scaling in chip-multiprocessors , 2007, Proceedings of the 2007 international symposium on Low power electronics and design (ISLPED '07).

[3]  V. Szekely,et al.  Identification of RC networks by deconvolution: chances and limits , 1998 .

[4]  L. Meysenc,et al.  Power electronics cooling effectiveness versus thermal inertia , 2005, IEEE Transactions on Power Electronics.

[5]  Cathy Biber,et al.  ASIC package lid effects on temperature and lifetime , 2011, 2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium.

[7]  Andrzej Kos,et al.  Thermal model of selected parts of human hand and thermal touch screen for the blind , 2012 .

[8]  M. Grecki,et al.  Transient temperature evaluation during switching process in static induction transistor , 1994 .

[9]  Mariusz Kastek,et al.  Measurement of Thermal Behavior of Detector Array Surface with the Use of Microscopic Thermal Camera , 2011 .

[10]  Marta Rencz,et al.  Thermal dynamics and the time constant domain , 2000 .

[11]  S. Birca-Galateanu.  On the thermal inertia of the semiconductor components , 2005, International Symposium on Signals, Circuits and Systems, 2005. ISSCS 2005..

[12]  V. Székely,et al.  Investigation of parallel heat flow path in electro-thermal microsystems , 2010, 2010 Symposium on Design Test Integration and Packaging of MEMS/MOEMS (DTIP).

[13]  D. Blackburn,et al.  Transient Thermal Response Measurements of Power Transistors , 1975 .

[14]  A. Napieralski,et al.  Application of Advanced Thermal Analysis Method for Investigation of Internal Package Structure , 2007, 2007 14th International Conference on Mixed Design of Integrated Circuits and Systems.