Organic Packages With Embedded Phased-Array Antennas for 60-GHz Wireless Chipsets
暂无分享,去创建一个
A. Natarajan | Duixian Liu | Dong Gun Kam | S. K. Reynolds | B. A. Floyd | A. Natarajan | B. Floyd | D. Kam | S. Reynolds | Duixian Liu
[1] Chul Soon Park,et al. 60-GHz System-on-Package Transmitter Integrating Sub-Harmonic Frequency Amplitude Shift-Keying Modulator , 2007, IEEE Transactions on Microwave Theory and Techniques.
[2] Duixian Liu,et al. Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications , 2009, IEEE Transactions on Antennas and Propagation.
[3] S. Gambini,et al. A 90 nm CMOS Low-Power 60 GHz Transceiver With Integrated Baseband Circuitry , 2009, IEEE Journal of Solid-State Circuits.
[4] Joungho Kim,et al. 40-Gb/s Package Design Using Wire-Bonded Plastic Ball Grid Array , 2008, IEEE Transactions on Advanced Packaging.
[5] Andrew J. Roscoe,et al. Large finite array analysis using infinite array data , 1994 .
[6] D. Pozar. Finite phased arrays of rectangular microstrip patches , 1986 .
[7] Shmuel Ravid,et al. A thirty two element phased-array transceiver at 60GHz with RF-IF conversion block in 90nm flip chip CMOS process , 2010, 2010 IEEE Radio Frequency Integrated Circuits Symposium.
[8] Alberto Valdes-Garcia,et al. A SiGe BiCMOS 16-element phased-array transmitter for 60GHz communications , 2010, 2010 IEEE International Solid-State Circuits Conference - (ISSCC).
[9] B. Gaucher,et al. Wideband Cavity-backed Folded Dipole Superstrate Antenna for 60 GHz Applications , 2006, 2006 IEEE Antennas and Propagation Society International Symposium.
[10] Jri Lee,et al. A Low-Power Low-Cost Fully-Integrated 60-GHz Transceiver System With OOK Modulation and On-Board Antenna Assembly , 2009, IEEE Journal of Solid-State Circuits.
[11] D. Staiculescu,et al. Design rule development for microwave flip-chip applications , 2000 .
[12] Duixian Liu,et al. A 16-element phased-array receiver IC for 60-GHz communications in SiGe BiCMOS , 2010, 2010 IEEE Radio Frequency Integrated Circuits Symposium.
[13] B. Gaucher,et al. A chip-scale packaging technology for 60-GHz wireless chipsets , 2006, IEEE Transactions on Microwave Theory and Techniques.
[14] B. Gaucher,et al. A Silicon 60-GHz Receiver and Transmitter Chipset for Broadband Communications , 2006, IEEE Journal of Solid-State Circuits.
[15] Duixian Liu,et al. Antenna-in-Package Design for Wirebond Interconnection to Highly Integrated 60-GHz Radios , 2009, IEEE Transactions on Antennas and Propagation.
[16] Joungho Kim,et al. Modeling and measurement of simultaneous switching noise coupling through signal via transition , 2006, IEEE Transactions on Advanced Packaging.
[17] Theodore S. Rappaport,et al. On-Chip Integrated Antenna Structures in CMOS for 60 GHz WPAN Systems , 2009, GLOBECOM 2009 - 2009 IEEE Global Telecommunications Conference.
[18] A. Lamminen,et al. 60-GHz Patch Antennas and Arrays on LTCC With Embedded-Cavity Substrates , 2008, IEEE Transactions on Antennas and Propagation.
[19] A. Tomkins,et al. A Zero-IF 60 GHz 65 nm CMOS Transceiver With Direct BPSK Modulation Demonstrating up to 6 Gb/s Data Rates Over a 2 m Wireless Link , 2009, IEEE Journal of Solid-State Circuits.
[20] B. Floyd,et al. Packages With Integrated 60-GHz Aperture-Coupled Patch Antennas , 2011, IEEE Transactions on Antennas and Propagation.
[21] Ieee Xplore. IEEE Transactions on Components, Packaging and Manufacturing Technology , 2019 .
[22] G. Ponchak,et al. Characterization of liquid crystal polymer (LCP) material and transmission lines on LCP substrates from 30 to 110 GHz , 2004, IEEE Transactions on Microwave Theory and Techniques.
[23] E. R. Pillai,et al. Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling , 1997 .
[24] Duixian Liu,et al. A Fully-Integrated 16-Element Phased-Array Receiver in SiGe BiCMOS for 60-GHz Communications , 2010, IEEE Journal of Solid-State Circuits.
[25] J. D. Krauss. Antennas For All Applications , 1950 .
[26] Duixian Liu,et al. A Fully Integrated 16-Element Phased-Array Transmitter in SiGe BiCMOS for 60-GHz Communications , 2010, IEEE Journal of Solid-State Circuits.