Effect of Deposition Conditions on Properties of Cu Thin Films Electrodeposited from Pyrophosphate Baths

Effects of current density, electrodeposition temperature and solution pH on properties of Cu thin films electrodeposited from pyrophosphate bath were investigated. Current efficiency was decreased with increasing current density and increased with increasing temperature. But solution pH slightly influenced on current efficiency and current efficiency was measured to be above 90% at both room temperature and . Residual stress of Cu thin film electrodeposited at room temperature was decreased with increasing current density, while current density reaches to 60 or more, stress became close to zero. Cu thin films electrodeposited at exhibited the residual stress range of 0~40 MPa. At room temperature, dendritic surface morphology was observed above the current density of 30 and at , above the current density of 100 . Cu thin films electrodeposited from bath solution with room temperature and mainly consisted of (111) peaks. Specially, Cu thin film electrodeposited at 30 and exhibited strong preferred orientation of (111) peaks.