An Introduction to Microelectromechanical Systems Engineering
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[1] N. C. MacDonald,et al. SCREAM I: A single mask, single-crystal silicon, reactive ion etching process for microelectromechanical structures , 1994 .
[2] U. Schnakenberg,et al. TMAHW etchants for silicon micromachining , 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.
[3] Robert E. Higashi,et al. Monolithic two-dimensional arrays of micromachined microstructures for infrared applications , 1998, Proc. IEEE.
[4] K. J. Gabriel. Microelectromechanical systems (MEMS) , 1997, 1997 IEEE Aerospace Conference.
[5] A. D. Johnson,et al. Recent progress in thin film shape memory microactuators , 1995, Proceedings IEEE Micro Electro Mechanical Systems. 1995.
[6] R. Ragan. Inertial technology for the future , 1984 .
[7] D. Walters,et al. Commercialization of silicon-based gas sensors , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).
[8] Huma Ashraf,et al. Advanced silicon etching using high-density plasmas , 1995, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
[9] K. Y. Lau,et al. Surface-micromachined microoptical elements and systems , 1998, Proc. IEEE.
[10] Mehran Mehregany,et al. Silicon carbide MEMS for harsh environments , 1998, Proc. IEEE.
[11] M. F. Chang,et al. A Surface Micromachined Miniature Switch For Telecommunications Applications With Signal Frequencies From DC Up To 4 Ghz , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.
[12] David T. Burke,et al. Microfabricated devices for genetic diagnostics , 1998, Proc. IEEE.
[13] G. Kovacs,et al. Bulk micromachining of silicon , 1998, Proc. IEEE.
[14] R. G. Johnson,et al. A highly sensitive silicon chip microtransducer for air flow and differential pressure sensing applications , 1987 .
[15] Stephen F. Bart,et al. An integrated force-balanced capacitive accelerometer for low-g applications , 1996 .
[16] J. D. Johnson,et al. An electroformed CMOS integrated angular rate sensor , 1998 .
[17] Tom Lewis,et al. Empire of the air , 1991 .
[18] D. S. Eddy,et al. Application of MEMS technology in automotive sensors and actuators , 1998 .
[19] Wataru Nakayama,et al. Electronic Packaging: Design, Materials, Process, and Reliability , 1998 .
[20] K. R. Williams,et al. Etch rates for micromachining processing , 1996 .
[21] K. R. Williams,et al. Novel interconnection technologies for integrated microfluidic systems , 1998 .
[22] Dimitri Kececioglu,et al. Reliability engineering handbook , 1991 .
[23] Takao Sasayama,et al. Highly Reliable Silicon 1%41cro-machined Physical Sensors In Mass Production , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.
[24] Jeff Hecht,et al. Understanding fiber optics (3rd ed.) , 1998 .
[25] J. T. Suminto,et al. A wide frequency range, rugged silicon micro accelerometer with overrange stops , 1996, Proceedings of Ninth International Workshop on Micro Electromechanical Systems.
[26] Ming C. Wu,et al. Micromachining for optical and optoelectronic systems , 1997, Proc. IEEE.
[27] D. W. Hoffman,et al. Stress-related effects in thin films , 1989 .
[28] P. Barth,et al. Silicon micromechanical devices , 1983 .
[29] J. Marek,et al. A precision yaw rate sensor in silicon micromachining , 1997 .
[30] H. A. Waggener,et al. Electrochemically controlled thinning of silicon , 1970, Bell Syst. Tech. J..
[31] Gregory T. A. Kovacs,et al. Microfabricated heavy metal ion sensor , 1995 .
[32] J. Bustillo,et al. Surface micromachining for microelectromechanical systems , 1998, Proc. IEEE.
[33] C. Mari,et al. The use of polymer materials as sensitive elements in physical and chemical sensors , 1987 .
[34] Judy M Rorison,et al. Properties of silicon. EMIS datareviews series no.4 , 1988 .
[35] Louis Thomas Manzione,et al. Plastic Packaging of Microelectronic Devices , 1990 .
[36] D. J. Harrison,et al. Planar chips technology for miniaturization and integration of separation techniques into monitoring systems. Capillary electrophoresis on a chip , 1992 .
[37] S. Timoshenko,et al. Analysis of Bi-Metal Thermostats , 1925 .
[38] H. Seidel,et al. Silicon angular rate sensor for automotive applications with piezoelectric drive and piezoresistive read-out , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).
[39] A. Heuberger,et al. Anisotropic Etching of Crystalline Silicon in Alkaline Solutions I . Orientation Dependence and Behavior of Passivation Layers , 1990 .
[40] H. Guckel,et al. High-aspect-ratio micromachining via deep X-ray lithography , 1998, Proc. IEEE.
[41] Thomas W. Kenny,et al. Low‐stiffness silicon cantilevers for thermal writing and piezoresistive readback with the atomic force microscope , 1996 .
[42] Farrokh Ayazi,et al. Micromachined inertial sensors , 1998, Proc. IEEE.
[43] J. M. Noworolski,et al. Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures , 1996 .
[44] William C. Tang,et al. Electrostatic-comb drive of lateral polysilicon resonators , 1990 .
[45] G. Agrawal. Fiber‐Optic Communication Systems , 2021 .
[46] J. Lasky. Wafer bonding for silicon‐on‐insulator technologies , 1986 .
[47] M. Richter,et al. A bidirectional silicon micropump , 1995 .
[48] M. Gretillat,et al. Vertical mirrors fabricated by deep reactive ion etching for fiber-optic switching applications , 1997 .
[49] Robert Pack. Nothing But Light , 1972 .
[50] W. Riethmuller,et al. Novel Process For A Monolithic Integrated Accelerometer , 1995, Proceedings of the International Solid-State Sensors and Actuators Conference - TRANSDUCERS '95.
[51] M. R. Douglass,et al. A MEMS-based projection display , 1998, Proc. IEEE.
[52] Ray P. Prasad. Surface Mount Technology , 1988 .
[53] G. Kovacs,et al. Thermally and electrically isolated single crystal silicon structures in CMOS technology , 1994, IEEE Electron Device Letters.
[54] G. Kovacs,et al. An approach to the classific ation of unknown biological agents with cell based sensors , 1998 .
[55] T. Rodgers,et al. UMOS transistors on , 1980, IEEE Transactions on Electron Devices.
[56] David M. Bloom,et al. Grating Light Valve: revolutionizing display technology , 1997, Electronic Imaging.
[57] M. Despont,et al. SU-8: a low-cost negative resist for MEMS , 1997 .
[58] Gregory T. A. Kovacs,et al. Novel analytical technique for on-line monitoring of trace heavy metals in corrosive chemicals , 1998 .
[59] S. D. Collins,et al. Study of electrochemical etch-stop for high-precision thickness control of silicon membranes , 1989 .
[60] J. R. Mallon,et al. Silicon fusion bonding for pressure sensors , 1988, IEEE Technical Digest on Solid-State Sensor and Actuator Workshop.
[61] Steve Winder,et al. Operational Amplifiers , 1971 .
[62] A. Woolley,et al. Ultra-high-speed DNA sequencing using capillary electrophoresis chips. , 1995, Analytical chemistry.
[63] K.E. Petersen,et al. Silicon as a mechanical material , 1982, Proceedings of the IEEE.
[64] Gregory T. A. Kovacs,et al. PECVD silicon carbide for micromachined transducers , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).
[65] G. Kovacs,et al. Force-balanced accelerometer with mG resolution, fabricated using Silicon Fusion Bonding and Deep Reactive Ion Etching , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).