Smeared-Property Models for Shock-Impact Reliability of Area-Array Packages

Portable electronics is subjected to extreme accelerations in shock and drop impact. Product development cycle times and the cost constraints often restrict the number of design variations tested for drop robustness prior to identification of the final configuration. Simulation models capable of predicting transient dynamics can provide valuable insight into the design reliability under shock environments. In this study, explicit finite-element models have been used to study the transient dynamics of printed circuit boards during drop from 6 ft. Methodologies for modeling components using smeared-property formulations have been investigated. Reduced integration element formulations examined include shell and solid elements. Model predictions have been validated with experimental data. Results show that models with smeared properties can predict transient-dynamic response of board assemblies in drop impact fairly accurately. High-speed data acquisition system has been used to capture in situ strain, continuity, and acceleration data in excess of 1X10 6 samples/s. Ultra-high-speed video at 40,000 fps has been used to capture the deformation kinematics. Component types examined include plastic ball-grid arrays, tape-array ball-grid array, quad-flat-no-lead package, and conduction-cooled ball-grid array. Model predictions have been correlated with experimental data. Impact of experimental error sources on model correlation with experiments has been also investigated.

[1]  S. Irving,et al.  Free drop test simulation for portable IC package by implicit transient dynamics FEM , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[2]  J.‐P. CIech,et al.  Solder Reliability Solutions: A PC‐based Design‐for‐reliability Tool* , 1997 .

[3]  P. Geng,et al.  Mechanical shock testing and modeling of PC motherboards , 2004, 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546).

[4]  P. Lall,et al.  Models for Reliability Prediction of Fine-Pitch BGAs and CSPs in Shock and Drop-Impact , 2004, IEEE Transactions on Components and Packaging Technologies.

[5]  Chen-Chi Lin.  Finite element analysis of a computer hard disk drive under shock , 2002 .

[6]  Jean-Paul Clech.  FLIP-CHIP / CSP ASSEMBLY RELIABILITY AND SOLDER VOLUME EFFECTS , 2000 .

[7]  Dongji Xie,et al.  Solder joint behavior of area array packages in board level drop for handheld devices , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[8]  Z. Zhong,et al.  Board level drop test and simulation of TFBGA packages for telecommunication applications , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[9]  Liping Zhu,et al.  Modeling technique for reliability assessment of portable electronic product subjected to drop impact loads , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..

[10]  J. Wu,et al.  Drop/impact simulation and test validation of telecommunication products , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).

[11]  W. Marcinkiewicz,et al.  Drop impact reliability analysis of CSP packages at board and product system levels through modeling approaches , 2004, The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543).

[12]  J. E. Field,et al.  Tackling the Drop Impact Reliability of Electronic Packaging , 2003 .

[13]  Chwee Teck Lim,et al.  Investigating the drop impact of portable electronic products , 2002, 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345).