The laser ablation model development of glass substrate cutting assisted with the thermal fracture and ultrasonic mechanisms
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Wen-Tse Hsiao | Kuo-Cheng Huang | Jer-Liang Andrew Yeh | Ru-Li Lin | W. Hsiao | Kuo-Cheng Huang | J. A. Yeh | R. Lin | Chi-Hung Hwang | C. Hwang
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