Flash enhanced SPI interface chip and chip packaging method

The present invention provides enhanced Flash chips and chip packaging method of SPI interface, designed to address the complexity is high, long design period and high design cost. The chip includes a package together and SPI FLASH RPMC; SPI FLASH and RPMC include separate controllers; the IO pins interconnecting the same SPI FLASH RPMC in and connected to the same shared external pin of the chip, SPI FLASH RPMC and each further comprising an internal IO pins interconnected internal IO pin, the internal SPI FLASH RPMC IO pin, the mutual communication between the interior and the SPI FLASH RPMC interconnected through an internal IO pins. Reduced package size, lower cost, and shorten the design cycle and improve the performance of the chip.