Microassembly technologies for MEMS

Microassembly promises to extend MEMS beyond the confines of silicon micrornachining. 'l'his paper surveys research in both serial and parallel microassembly. The former extends conventional "pick and place assembly into the micro-domain. where surface forces play a dominant role. Parallel assembly involves the simultaneous precise organization of an ensemble of micro components. This can he achieved by microstructure transfer between aligned wafers or arrays of binding sites that trap an initially random collection of parts. Binding sites can he microniachined cavities or electrostatic traps short-range attractive forces and random agitation of the parts serve to fill the sites. Microassembly strategies should furnish reliable mechanical bonds and electrical interconnection between the micropart and die target substrate or subassembly.

[1]  U. Gösele,et al.  Low temperature wafer direct bonding , 1994 .

[2]  Hongtao Han,et al.  Design and modeling of a micromechanical surface bonding system , 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.

[3]  K.-F. Bohringer,et al.  A theory of manipulation and control for microfabricated actuator arrays , 1994, Proceedings IEEE Micro Electro Mechanical Systems An Investigation of Micro Structures, Sensors, Actuators, Machines and Robotic Systems.

[4]  E. Yablonovitch,et al.  Extreme selectivity in the lift‐off of epitaxial GaAs films , 1987 .

[5]  Albert P. Pisano,et al.  Self-adjusting microstructures (SAMS) , 1991, [1991] Proceedings. IEEE Micro Electro Mechanical Systems.

[6]  D. Kossives,et al.  GaAs MQW modulators integrated with silicon CMOS , 1995, IEEE Photonics Technology Letters.

[7]  A. Pisano,et al.  Self-assembling electrical networks: an application of micromachining technology , 1991, TRANSDUCERS '91: 1991 International Conference on Solid-State Sensors and Actuators. Digest of Technical Papers.

[8]  B Wagner,et al.  Levitation, holding, and rotation of cells within traps made by high-frequency fields. , 1992, Biochimica et biophysica acta.

[9]  James A. Folta,et al.  Low‐Temperature Wafer Bonding of Surfaces Using a Reactive Sputtered Oxide , 1994 .

[10]  M. Shimbo,et al.  Silicon‐to‐silicon direct bonding method , 1986 .

[11]  Karan V. I. S. Kaler,et al.  Dynamic dielectrophoretic levitation of living individual cells , 1980 .

[12]  Gregory T. A. Kovacs,et al.  Computational methods for design and control of MEMS micromanipulator arrays , 1997 .

[13]  Wen-Hwa Martin Chu.  Microfabricated tweezers with a large gripping force and a large range of motion , 1994 .

[14]  Leonard S. Goodman.  Geometric optimization of controlled collapse interconnections , 1969 .

[15]  K. Pister,et al.  A planar air levitated electrostatic actuator system , 1990, IEEE Proceedings on Micro Electro Mechanical Systems, An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots..

[16]  Hiroyuki Fujita,et al.  A conveyance system using air flow based on the concept of distributed micro motion systems , 1994 .

[17]  C. Camperi-Ginestet,et al.  Alignable epitaxial liftoff of GaAs materials with selective deposition using polyimide diaphragms , 1991, IEEE Photonics Technology Letters.

[18]  Vijayakumar R. Dhuler,et al.  Smart MEMS: flip chip integration of MEMS and electronics , 1995, Smart Structures.

[19]  Ralph L. Hollis,et al.  Cooperative 2-DOF robots for precision assembly , 1996, Proceedings of IEEE International Conference on Robotics and Automation.

[20]  U. Gösele,et al.  Semiconductor wafer bonding: recent developments , 1994 .

[21]  M. Prentiss,et al.  Microlithography by using neutral metastable atoms and self-assembled monolayers , 1995, Science.

[22]  G. Yarrington.  Molecular Cell Biology , 1987, The Yale Journal of Biology and Medicine.

[23]  R. Horowitz,et al.  Design and fabrication of an angular microactuator for magnetic disk drives , 1998 .

[24]  C. Bark,et al.  Gripping with low viscosity fluids , 1998, Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176.

[25]  Hajime Hitakawa,et al.  Advanced parts orientation system has wide application , 1988 .

[26]  Ken Goldberg,et al.  Electrostatic Self-Assembly Aided by Ultrasonic Vibration , 1997 .

[27]  J. Bustillo,et al.  Embedded interconnect and electrical isolation for high-aspect-ratio, SOI inertial instruments , 1997, Proceedings of International Solid State Sensors and Actuators Conference (Transducers '97).

[28]  Peter M. Will,et al.  Parts manipulation on an intelligent motion surface , 1995, Proceedings 1995 IEEE/RSJ International Conference on Intelligent Robots and Systems. Human Robot Interaction and Cooperative Robots.

[29]  Chang-Jin Kim,et al.  Microriveting-a new wafer joining method , 1997, Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots.