Evaluation ofThermalCharacteristics andThermomechanical Reliability ofStacked-die Packages UnderCoupled PowerandThermalCycling TestConditions

Thesequential thermal-mechanical coupling analysis, whichsolves inturnthetransient temperature field and subsequent thermomechanical deformations, isperformed to investigate thermalcharacteristics alongwithfatigue reliability ofaboard-level stacked-die package under coupled power andthermal cycling testconditions. Different powering conditions andsequencesarecompared. Fromthenumerical results, we notethat under coupled power andthermal cycling tests, reliability performances ofa board-level stacked-die packageshouldbe similar as longas thetotal power dissipation prescribed tothepackage isidentical, regardless ofhowthepower distributes among separate dies.