Modeling of the thermal and hydraulic performance of plate fin, strip fin, and pin fin heat sinks-influence of flow bypass
暂无分享,去创建一个
[1] Ephraim M Sparrow,et al. Effect of tip-to-shroud clearance on turbulent heat transfer from a shrouded, longitudinal fin array , 1986 .
[2] Masaru Ishizuka,et al. Cooling performance of plate fins for multichip modules , 1994, Proceedings of 1994 4th Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM).
[3] Ephraim M Sparrow,et al. Pressure Drop Characteristics for a Shrouded Longitudinal-Fin Array with Tip Clearance , 1981 .
[4] Bahram Moshfegh,et al. Modeling and characterisation of plate fin heat sinks under bypass flow conditions using computational fluid dynamics methods , 2001 .
[5] Bahram Moshfegh,et al. Influence of fin spacing, fin thickness and inlet velocity on the performance of plate fin heat sinks under varying bypass conditions using CFD , 2000 .
[6] Richard A. Wirtz,et al. Effect of Flow Bypass on the Performance of Longitudinal Fin Heat Sinks , 1994 .
[7] J. E. Sunderland,et al. Forced convection heat transfer from staggered pin fin arrays , 1996 .
[8] C. L. Chapman,et al. Thermal performance of an elliptical pin fin heat sink , 1994, Proceedings of 1994 IEEE/CHMT 10th Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM).
[9] Ephraim M Sparrow,et al. Forced Convection Heat Transfer from a Shrouded Fin Array with and without Tip Clearance , 1978 .
[10] D. Metzger,et al. Effects of Pin Shape and Array Orientation on Heat Transfer and Pressure Loss in Pin Fin Arrays , 1984 .
[11] P. W. Runstadler,et al. Numerical and experimental evaluation of planar and staggered heat sinks , 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.
[12] Ephraim M Sparrow,et al. Heat transfer and fluid flow analysis of interrupted-wall channels with application to heat exchangers , 1977 .
[13] H. Jonsson,et al. Thermal and hydraulic behavior of plate fin and strip fin heat sinks under varying bypass conditions , 1998, ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208).
[14] Eric Beyne,et al. Design of an optimal heat-sink geometry for forced convection air cooling of Multi-Chip Modules , 1994 .
[15] Ephraim M Sparrow,et al. Heat transfer and pressure drop for a staggered wall-attached array of cylinders with tip clearance , 1978 .
[16] R. L. Mahajan,et al. Effects of tip clearance and fin density on the performance of heat sinks for VLSI packages , 1989 .
[17] Ephraim M Sparrow,et al. Heat-transfer, pressure-drop and performance relationships for in-line, staggered, and continuous plate heat exchangers , 1979 .
[18] Ephraim M Sparrow,et al. Numerical and experimental study of turbulent heat transfer and fluid flow in longitudinal fin arrays , 1986 .
[19] Masaru Ishizuka,et al. Development of prediction technique for cooling performance of finned heat sink in uniform flow , 1996 .
[20] A. London,et al. Compact heat exchangers , 1960 .
[21] Minking K. Chyu,et al. Effects of Perpendicular Flow Entry on Convective Heat/Mass Transfer From Pin-Fin Arrays , 1999 .
[22] Toshiyuki Kameoka,et al. An Experimental Investigation on Heat Transfer by Pin Fins Fixed on a Plate , 1970 .
[23] Bahram Moshfegh,et al. CFD modeling of the cooling performance of pin fin heat sinks under bypass flow conditions , 2001 .
[24] H. Jonsson,et al. Influence of Airflow Bypass on the Thermal Performance and Pressure Drop of Plate Fin and Pin Fin Heat Sinks for Electronics Cooling , 1997 .
[25] K. Azar,et al. Effect of Pin Fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks , 1994 .
[26] H. Jonsson. Turbulent Forced Convection Air Cooling of Electronics with Heat Sinks Under Flow Bypass Conditions , 2001 .
[27] M. Ishizuka,et al. Development of prediction technique for cooling performance of finned heat sink in uniform flow , 1996, InterSociety Conference on Thermal Phenomena in Electronic Systems, I-THERM V.