论文信息 - Simplified empirical formula on TSV thermal analysis for 3D IC EDA

Simplified empirical formula on TSV thermal analysis for 3D IC EDA

In this paper, based on the formulas of the classic theory of heat conduction, proposed a temperature distribution formula in the three-dimensional space, which can effectively and accurately calculated the temperature value at any coordinate-point within the TSV (Through Silicon Via) model. By simulating the behavior of heat conduction and analyzing temperature data, this paper proposed the simplified empirical formula of temperature distribution for analyzing in 3D IC, and compared the calculated value with the simulation value to validate. These results will be easy to estimate the range of temperature change for EDA toll.

Ligang Hou | Bo Lu | Jinhui Wang | Jingyan Fu

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