An integrated packaging antenna‐diplexer module for cellular/SDMB bands with LTCC technology
暂无分享,去创建一个
[1] C.-H. Lee,et al. Broadband highly integrated LTCC front-end module for IEEE 802.11a WLAN applications , 2002, 2002 IEEE MTT-S International Microwave Symposium Digest (Cat. No.02CH37278).
[2] J. Estes,et al. Integration of a receiver front-end in multilayer ceramic integrated circuit (MCIC) technology , 1997, Proceedings of 1997 Wireless Communications Conference.
[3] Y. Yoon,et al. A compact lumped-element lowpass filter using low temperature cofired ceramic technology , 2003 .
[4] Chul Soon Park,et al. Monolithic LTCC SiP transmitter for 60GHz wireless communication terminals , 2005, IEEE MTT-S International Microwave Symposium Digest, 2005..
[5] C.-H. Lee,et al. Embedded IC packaging technology for ultra-thin and highly compact RF module , 2003, 53rd Electronic Components and Technology Conference, 2003. Proceedings..
[6] Young Joong Yoon,et al. Broadband multilayer ceramic chip antenna for handsets , 2002 .