Electrical properties and electrochemical migration characteristics of directly printed Ag patterns with various sintering conditions

Abstract In this study, we investigated the phenomena of electrochemical migration (ECM) on a silicon (Si) substrate with directly printed Ag pattern using the screen-printing method. The microstructures and electrical characteristics of the directly printed Ag patterns under different sintering conditions were estimated. In addition, the ECM characteristics of the directly patterned Ag circuits on Si substrates were evaluated according to the sintering conditions. Clusters were formed by interparticle necking during the sintering process; the cluster size in the patterns increased as the sintering temperature and time increased. Granular Ag films, which were sintered at high temperatures and for long time periods of time, had excellent electrical characteristics as a result of the formation of interparticle necking of sufficient size. Also, the directly printed Ag patterns exposed to higher sintering temperatures and longer sintering times had higher resistances to ECM than those exposed to lower sintering temperatures and shorter sintering times.

[1]  Seung-Boo Jung,et al.  Characteristics of environmental factor for electrochemical migration on printed circuit board , 2008 .

[2]  A. Yabuki,et al.  Electrical conductivity of copper nanoparticle thin films annealed at low temperature , 2010 .

[3]  Rashid O. Kadara,et al.  Manufacturing electrochemical platforms: Direct-write dispensing versus screen printing , 2008 .

[4]  Seung-Boo Jung,et al.  Evaluation of Electrochemical Migration on Flexible Printed Circuit Boards with Different Surface Finishes , 2009 .

[5]  Gábor Harsányi,et al.  New types of reliability problems in porous ceramic based microdevices , 1996 .

[6]  Thomas W. Eagar,et al.  Electrochemical migration tests of solder alloys in pure water , 1997 .

[7]  Gábor Harsányi,et al.  Comparing migratory resistive short formation abilities of conductor systems applied in advanced interconnection systems , 2001, Microelectron. Reliab..

[8]  Robert A. Street,et al.  Jet printing flexible displays , 2006 .

[9]  Seung-Boo Jung,et al.  Effect of surface finish material on printed circuit board for electrochemical migration , 2008, Microelectron. Reliab..

[10]  G. Inzelt,et al.  A new method for comparing migration abilities of conductor systems based on conventional electroanalytical techniques , 2000, 2000 Proceedings. 50th Electronic Components and Technology Conference (Cat. No.00CH37070).

[11]  Wansoo Nah,et al.  Characterization of direct patterned Ag circuits for RF application , 2010 .

[12]  Seung-Boo Jung,et al.  Microstructure, Electrical Properties, and Electrochemical Migration of a Directly Printed Ag Pattern , 2011 .

[13]  Jang-Woo Lee,et al.  A comparative study on roll-to-roll gravure printing on PET and BOPP webs with aqueous ink , 2009 .

[14]  J. Oh,et al.  Inkjet printing of conductive Ag lines and their electrical and mechanical characterization , 2010 .

[15]  X. Zhao,et al.  Immobilizing catalysts on porous materials , 2006 .