Fault coverage estimation model for partially testable multichip modules
暂无分享,去创建一个
[1] Francesco Corsi,et al. Defect level as a function of fault coverage and yield , 1993, Proceedings ETC 93 Third European Test Conference.
[2] Marcelo Lubaszewski,et al. A pragmatic test and diagnosis methodology for partially testable MCMs , 1994, Proceedings of IEEE Multi-Chip Module Conference (MCMC-94).
[3] Chih-Ang Chen,et al. BIST/DFT for performance testing of bare dies and MCMs , 1994, Proceedings of ELECTRO '94.
[4] S. D. Millman. Improving quality: yield vs. test coverage (WSI) , 1993, 1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration.
[5] Francesco Corsi,et al. Defect level for non-equiprobable faults in digital ICs , 1993 .
[6] Brown,et al. Defect Level as a Function of Fault Coverage , 1981, IEEE Transactions on Computers.
[7] R. J. Wagner,et al. High-yield assembly of multichip modules through known-good IC's and effective test strategies , 1992, Proc. IEEE.
[8] F. Brglez,et al. A neutral netlist of 10 combinational benchmark circuits and a target translator in FORTRAN , 1985 .
[9] J. P. Teixeira,et al. Defect level estimation for digital ICs , 1992, Proceedings 1992 IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems.
[10] Adit D. Singh,et al. On optimizing VLSI testing for product quality using die-yield prediction , 1993, IEEE Trans. Comput. Aided Des. Integr. Circuits Syst..
[11] João Paulo Teixeira,et al. Fault modeling and defect level projections in digital ICs , 1994, Proceedings of European Design and Test Conference EDAC-ETC-EUROASIC.
[12] Gordon D. Robinson,et al. Interconnect testing of boards with partial boundary scan , 1990, Proceedings. International Test Conference 1990.