论文信息 - Formation of Circuit Pattern on Liquid-Crystalline Polymer Film by Electroless Copper Plating

Formation of Circuit Pattern on Liquid-Crystalline Polymer Film by Electroless Copper Plating

Liquid-crystalline polymer (LCP) films were treated with N2 plasma in order to improve adhesion with metal film. By N2 plasma treatment, hydrophilic groups such as NH, COOH and OH were introduced into LCP film and the surface of the film was roughened slightly. After N2 plasma treatment, a copper film was deposited on the LCP by electroless plating method. The circuit pattern of copper film with 0.5 mm (line) and 0.3 mm (space) intervals was fabricated on the LCP film.

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