Method and device for soldering part

PURPOSE: To achieve inspection and repairing easily by depositing a certain amount of solder that is adjusted on a pad region that corresponds to a second part, bringing a first part to the second part so that each hole is positioned at a corresponding pad region, and performing heating, so that solder can be melted and at the same time a fillet where the solder spreads through the metallization hole can be observed easily. CONSTITUTION: A flexible circuit 10 is positioned on a substrate 14, and a hole 13 is aligned properly onto a corresponding pad 15 on the substrate 14. A high-temperature ram 22 pushes a depressing element 23 and heats an assembly, consisting of a shuttle 20, a flexible circuit 10, and the printed circuit board 14. A deposition solder 30 is melted and flows through a plate through-hole 13, covers a pad 12 and forms a solder fillet 31, and eliminates a gap between the circuit 10 and the layer 16 on the printed circuit board 14. By selecting a proper amount of solder for each pad 15, the solder passes through the hole 13 and spreads to a surface at the opposite side of the printed circuit of the flexible circuit 10. The solder that has penetrated through the hole 13 forms a sufficient fillet 31 on a conductive part 12 on the surface at the opposite side, thus enabling defects and parts to be repaired at a solder connection part to be confirmed with a simple visual inspection from an area above an assembly. COPYRIGHT: (C)1991,JPO