Design considerations for using integrated passive components

The demand for smaller, lighter, faster and less expensive electronic products has led to the development of a laminate multi-chip module (MCM-L) process that contains integrated passive components. The University of Arkansas (UA) cooperated with Sheldahl Corporation and the Rensselaer Polytechnic Institute (RPI), as a member of the DARPA funded MCM-L consortium, to develop this integrated passive MCM-L (IPMCM-L) process. It contains resistors, capacitors and inductors integrated in a flexible film. Parasitic extraction, modeling, and simulation must be performed to effectively utilize this process for high performance circuits. A design methodology addressing these issues is discussed along with the process layers and example device layouts.

[1]  Simon S. Ang,et al.  The interconnected mesh power system (IMPS) MCM topology , 1994, Proceedings of 1994 IEEE Electrical Performance of Electronic Packaging.

[2]  S. S. Ang,et al.  A low-cost MCM design topology-the interconnected mesh power system (IMPS) , 1995, Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95).

[3]  Leonard W. Schaper,et al.  Embedded thin film resistors, capacitors and inductors in flexible polyimide films , 1996, 1996 Proceedings 46th Electronic Components and Technology Conference.

[4]  Simon S. Ang,et al.  Electrical characterization of the interconnected mesh power system (IMPS) MCM topology , 1994 .

[5]  Leonard W. Schaper,et al.  Advanced interconnected mesh power system (IMPS) MCM topologies , 1996, Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893).