베이퍼챔버형 히트파이프를 이용한 선박 및 해양플랜트 LED 실내조명 시스템용 고효율 방열부품 개발
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High-power light emitting diodes (LEDs), a strong candidate for the next generation illumination applications, are of interest. Because of the LEDs have many advantages such power saving long life compared with traditional incandescent bulb, the LEDs are rapidly using many applications such as LCD backlighting, traffic light, automotive lighting, signage, etc. Especially, it has attracted the attention of the shipbuilding industries. The increased electrical currents used to drive the LEDs have focused on the thermal management because the efficiency and reliability of conventional lighting devices strongly depend on successful thermal management. There are few problems that are caused by heat generation in the LED package, such as wire breakage, yellowing of epoxy resin, lifted chip caused by reflow of thermal paste chip attach and interfacial separation between LED package and silicon resin. This study is to evaluate thermal characteristics of LED indoor lighting system using vapor chamber type heat pipe for ship and offshore plants.