A chemical kinetics model to explain the abrasive size effect on chemical mechanical polishing

Abstract A chemical kinetics model was proposed to describe the abrasive size effect on chemical mechanical polishing (CMP). The model is based on the consideration of a pad as a sort of catalyst and the re-adhering of abrasives due to the large size. Therefore, a general equation was deduced according the chemical kinetics methodology to give the meanings of the size effect. Finally, according a set of data related to the abrasive size effect on CMP, a possible form can be PR= αC C C T X A C WA n /[ β + γX A C WA n ] where α , β , γ and n are the parameters in a CMP system.