Semiconductor device and pad arrangement method thereof

The present invention discloses a pad layout method of the semiconductor device and the device. The device includes a substrate, a first at least one first active region formed in a region, the at least one formed in a second area adjacent the first area, the second active region of the substrate of the substrate, the one of the plurality disposed on a second active region of claim first contact with the first active region above and the first contact of the first insulating film disposed between the first contact and the second of the plurality is placed on top of the poly disposed in a pulley, a second region disposed above the first insulating film a second consists of the contact, the pad disposed on the first area of ​​the above polyester and a second insulating film disposed between the second contact disposed on, and the second insulating film and the second contact. Therefore, through the contact disposed below the pad, the heat generated inside the device can be efficiently emitted.