Residual Stress Development in Adhesive Joints Subjected to Thermal Cycling

Abstract The effect of thermal cycling on the state of residual stress in thermoviscoelastic polymeric materials bonded to stiff elastic substrates was investigated using numerical techniques, including finite element methods. The work explored the relationship between a cyclic temperature environment, temperature-dependent viscoelastic behavior of polymers, and thermal stresses induced in a bimaterial system. Due to the complexity of developing a closed-form solution for a system with time- and temperature-dependent material properties, and time-varying temperature and coupled boundary conditions, numerical techniques were used to acquire approximate solutions. The results indicate that residual stresses in an elastic-viscoelastic bimaterial system incrementally shift over time when subjected to thermal cycling. Potentially damaging tensile axial and peel stresses develop over time as a result of viscoelastic response to thermal stresses induced in the polymeric layer. The applied strain energy release r...

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