Novel Re-configurable Circuits For Aging Characterization: Connecting Devices to Circuits
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Ketul Sutaria | Jihan Standfest | Inanc Meric | Amirhossein H. Davoody | Swaroop Kumar Namalapuri | T. Mutyala | P. Supriya | Balkaran Gill | Stephen Ramey | Jeffery Hicks | S. Ramey | B. Gill | K. Sutaria | I. Meric | A. Davoody | P. Supriya | S. Namalapuri | Jeffery Hicks | Jihan Standfest | Trinadh Mutyala
[1] Ru Huang,et al. Diagnosing bias runaway in analog/mixed signal circuits , 2014, 2014 IEEE International Reliability Physics Symposium.
[2] James Tschanz,et al. Postsilicon Voltage Guard-Band Reduction in a 22 nm Graphics Execution Core Using Adaptive Voltage Scaling and Dynamic Power Gating , 2017, IEEE Journal of Solid-State Circuits.
[3] A. Rahman,et al. Intrinsic transistor reliability improvements from 22nm tri-gate technology , 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).
[4] S. Ramey,et al. Transistor reliability variation correlation to threshold voltage , 2015, 2015 IEEE International Reliability Physics Symposium.
[5] Tanya Nigam,et al. Fast Wafer-Level Stress-and-Sense Methodology for Characterization of Ring-Oscillator Degradation in Advanced CMOS Technologies , 2015, IEEE Transactions on Electron Devices.
[6] S. Kumar,et al. Investigation of speed sensors accuracy for process and aging compensation , 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).
[7] T. Nigam,et al. Device reliability metric for end-of-life performance optimization based on circuit level assessment , 2017, 2017 IEEE International Reliability Physics Symposium (IRPS).
[8] T. Nigam,et al. Assessing device reliability margin in scaled CMOS technologies using ring oscillator circuits , 2017, 2017 IEEE Electron Devices Technology and Manufacturing Conference (EDTM).
[9] S. Mudanai,et al. 22FFL: A high performance and ultra low power FinFET technology for mobile and RF applications , 2017, 2017 IEEE International Electron Devices Meeting (IEDM).
[10] Peter R. Kinget,et al. Recent advances in in-situ and in-field aging monitoring and compensation for integrated circuits: Invited paper , 2018, 2018 IEEE International Reliability Physics Symposium (IRPS).
[11] A. Rahman,et al. Reliability studies of a 22nm SoC platform technology featuring 3-D tri-gate, optimized for ultra low power, high performance and high density application , 2013, 2013 IEEE International Reliability Physics Symposium (IRPS).