Wafer bonding of silicon wafers covered with various surface layers
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M. Reiche | U. Gösele | M. Wiegand | K. Gutjahr | D. Stolze | R. Longwitz | E. Hiller
[1] J. Härtwig,et al. Interfacial Properties of Silicon Structures Fabricated by Vacuum Grooved Surface Bonding Technology , 1998 .
[2] P. Lambeck,et al. Present and future role of chemical mechanical polishing in wafer bonding , 1998 .
[3] Jiwei Jiao,et al. Influence of processes and selective bonding technology , 1997, Photonics West - Micro and Nano Fabricated Electromechanical and Optical Components.
[4] S Sánchez,et al. Spontaneous direct bonding of thick silicon nitride , 1997 .
[5] N. D. Samaan,et al. A Low Temperature Direct Bonding Method Using an Electron-Beam Evaporated Silicon-Oxide Interlayer , 1996 .
[6] James A. Folta,et al. Low‐Temperature Wafer Bonding of Surfaces Using a Reactive Sputtered Oxide , 1994 .
[7] H. Massoud,et al. Causes and Prevention of Temperature-Dependent Bubbles in Silicon Wafer Bonding , 1991 .
[8] T. Mii,et al. Bubble-Free Wafer Bonding of GaAs and InP on Silicon in a Microcleanroom , 1989 .
[9] W. Maszara,et al. Bonding of silicon wafers for silicon‐on‐insulator , 1988 .
[10] A. G. Pedrine,et al. Low Temperature Wafer Bonding On SiliconNitride , 1995 .